反熔丝FPGA器件应用失效分析  

Failure Analysis of Anti-Fuse FPGA Device Applications

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作  者:完文韬 郭永强 孙杰杰[1] 隽扬 WAN Wentao;GUO Yongqiang;SUN Jiejie;JUAN Yang(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China;China Electronics Technology Group Corporation No.29 Research Institute,Chengdu 610036,China)

机构地区:[1]中国电子科技集团公司第五十八研究所,江苏无锡214035 [2]中国电子科技集团公司第二十九研究所,成都610036

出  处:《电子与封装》2024年第9期96-99,共4页Electronics & Packaging

摘  要:反熔丝器件具有低功耗、高可靠、抗辐照性能优良等特点,作为航天领域广泛使用的核心芯片,其失效机理尤为重要。针对某型反熔丝器件板级应用失效问题,列出故障树,对疑点逐一排查,配合后仿真波形,最终定位了故障原因,并进行了失效机理分析。故障发生原因与开发软件版本等因素相关,使用者往往不了解软件版本的更新细节,该因素通常不易被设计者重视。针对该失效问题提出了解决措施,选取样品重新进行烧写测试。经过实测验证,故障现象消失,改进措施有效。Anti-fuse device has the characteristics of low power consumption,high reliability and excellent anti-irradiation performance.As the widely used core chips in the aerospace field,the failure mechanism is particularly important.For the failure problem of a certain type of anti-fuse device board level application,the fault tree is listed,and the suspected points are investigated one by one.With the post-simulation waveforms,the cause of the failure is finally located,and failure mechanism is analyzed.The cause of the failure is related to the development software version and other factors,which are not easily taken into account by designers because users are often unaware of the details of software version updates.To solve the failure problem,the solution is proposed by selecting samples for re-burning test.After actual testing and verification,the failure phenomenon disappears,and the improvement measures are effective.

关 键 词:反熔丝型FPGA Libero软件版本 失效分析 

分 类 号:TN406[电子电信—微电子学与固体电子学]

 

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