继电器类封装管壳的电压击穿分析  

Analysis of Voltage Breakdown of Relay Packaging Shell

作　　者：王宇飞 王飞 杨文波 郝泽泽 侯丝丝 WANG Yufei;WANG Fei;YANG Wenbo;HAO Zeze;HOU Sisi(Xi'an Saier Electronic Materials Technology Co.,Ltd.,Shaanxi 710200,China)

机构地区：[1]西安赛尔电子材料科技有限公司,陕西710200

出　　处：《电子技术（上海）》2024年第6期410-412,共3页Electronic Technology

摘　　要：阐述碳钢类管壳熔封后出现的玻璃绝缘子击穿现象。利用SEM进行电压击穿的机理分析,发现耐电压与玻璃体的气泡数量、气泡孔径以及玻璃微裂纹关系密切。探讨玻璃绝缘子种类、熔封次数、洁净度等工艺因素与耐电压的关系,得出玻璃表面的洁净度也是导致玻璃绝缘子发生电压击穿的重要因素。This paper expounds the phenomenon of glass insulator breakdown that occurs after the fusion sealing of carbon steel pipe shells.Using SEM to analyze the mechanism of voltage breakdown,it was found that the withstand voltage is closely related to the number and pore size of glass bubbles,as well as glass microcracks.It explores the relationship between process factors such as the type of glass insulator,sealing frequency,cleanliness,and withstand voltage,and obtains that the cleanliness of the glass surface is also an important factor leading to voltage breakdown of glass insulators.

关 键 词：击穿电压 洁净度 玻璃绝缘子 微裂纹 

分 类 号：TM503.5[电气工程—电器]