太赫兹真空器件中超深金属慢波结构的微加工技术  

Micromachining Technology of Ultra-Deep Metal Slow Wave Structure of Terahertz Vacuum Electronic Devices

作　　者：姜琪 李兴辉[1] 冯进军[1] 蔡军[1] 潘攀[1] JIANG Qi;LI Xinghui;FENG Jinjun;CAI Jun;PAN Pan(National Key Laboratory of Science and Technology on Vacuum Electronics,Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]北京真空电子技术研究所微波电真空器件国家级重点实验室,北京100015

出　　处：《真空科学与技术学报》2024年第9期759-767,共9页Chinese Journal of Vacuum Science and Technology

基　　金：大功率微波电真空器件技术国防科技重点实验室基金项目(10249)。

摘　　要：太赫兹真空电子器件物理结构尺寸变化随着波长的减小而减小,对微小结构的尺寸精度与表面粗糙度要求也大大增加。随着器件频率进入到太赫兹频段,慢波结构的深度达到几十微米或者百微米量级,加工的难点主要有:材料为金属,结构超深,表面粗糙度要求达到几十纳米量级,微电铸后金属含氧量极小,结构密度大不漏气,经得起后续近千摄氏度的高温处理工艺等。文章介绍了太赫兹频段下器件慢波结构的加工方式,着重讨论利用深反应离子刻蚀(DRIE)技术和紫外−光刻、电铸(UV-LIGA)技术加工超深金属慢波结构的技术和和特点,并介绍了本实验室利用UV-LIGA加工折叠波导的研究进展。With the increase in frequency of vacuum electronic devices,the size of slow wave structure is reduced to tens of microns,and requirements for dimensional accuracy and surface roughness are constantly increasing during processing.The processing method of slow wave structure at terahertz frequency is introduced in this paper.The characteristics and research status of deep reactive ion etching(DRIE)and ultraviolet-Lithographie Galvanoformung Abformung(UV-LIGA)are discussed.The research progress of the folded waveguide with UVLIGA in national key laboratory of science and technology on vacuum electronics is also introduced.

关 键 词：太赫兹真空电子器件 微机电系统 深反应离子刻蚀 紫外−光刻、电铸 慢波结构 

分 类 号：TN105[电子电信—物理电子学]