塑封和密封集成电路结构分析方法及案例研究  

Construction Analysis Methods and Case Studies of Plastic Packaging and Sealed Integrated Circuits

作　　者：胡凛 谢霞平 曹浩龙 付清轩 HU Lin;XIE Xiaping;CAO Haolong;FU Qingxuan(CEPREI,Guangzhou 511370,China;Industrial Technology Business Group Midea Group,Foshan 52800,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]美的集团工业技术事业群,广东佛山528000

出　　处：《电子质量》2024年第9期28-35,共8页Electronics Quality

摘　　要：元器件结构分析技术能够有效地发现元器件中结构缺陷、设计缺陷和材料选用缺陷,是提升元器件可靠性的重要手段,是元器件应用的有效验证技术。通过对塑封和密封半导体集成电路的结构特点进行研究,提出了一种国产元器件结构分析方法,并以典型案例对该方法开展研究。该方法能够有效地指导国产元器件结构分析工作,提升国产元器件的质量和可靠性。The technology of component construction analysis can effectively detect construction defects,design defects,and material selection flaws in components.It is an important means to improve the reliability of component,and an effective verification technology for component applications.Through the study of the construction characteristics of plastic packaging and sealed semiconductor integrated circuits,a method of construction analysis for domestic components is proposed,and the research on this method is carried out with typical cases.This method can effectively guide the construction analysis work of domestic components and improve the quality and reliability of domestic components.

关 键 词：电子元器件 结构分析 塑封集成电路 密封集成电路 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学] TB114.39[理学—概率论与数理统计]