玻璃通孔TGV技术的性能优势及应用前景  

Performance advantages and application prospects of glass through-hole TGV technology

作　　者：赵龙江 杨威 侯宏荣 徐剑 张志军 王答成 ZHAO Longjiang;YANG Wei;HouHongrong;XU Jian;Zhangzhijun;WANG Dacheng(Rainbow Display Devices Co.,Ltd.,Xianyang,Shaanxi 712000;Flat Panel Display Glass Technology National Engineering Research Center,Xianyang,Shaanxi 712000)

机构地区：[1]彩虹显示器件股份有限公司,陕西咸阳712000 [2]平板显示玻璃工艺技术国家工程研究中心,陕西咸阳712000

出　　处：《中国建材科技》2024年第S01期29-30,47,共3页China Building Materials Science & Technology

基　　金：陕西省厅市联动重点项目:高效能G8.5基板玻璃制备技术研发2022GD-TSLD-01。

摘　　要：作为封装中所用的中间基板,玻璃虽然具有的高平滑性、和Si同等的热膨胀率等有利条件,但传统的玻璃微孔加工技术无法克服玻璃通孔的微裂纹、碎裂及热应力等问题,因此之前作为电子封装的expansion,CTE材质均为陶瓷或有机材料,近几年随着激光深度诱导刻蚀技术(LIDE)的出现,使得玻璃作为电子封装中间基板的优势又进一步发挥出来,玻璃通孔孔径可以实现10~100μm,纵横比可以根据应用场景实时设计。as an intermediate substrate used in packaging,although glass has high smoothness,the same thermal expansion rate as Si and other favorable conditions,but the traditional glass microporous processing technology can not overcome the problems of microcracks,fragmentation and thermal stress of glass vias,so the materials used as electronic packaging are ceramic or organic materials,in recent years,with the emergence of laser depth induced etching technology(LIDE),the advantages of glass as an intermediate substrate for electronic packaging have been further exerted,and the glass through hole diameter can achieve 10~100μm,the aspect ratio can be designed in real time according to the application scenario.

关 键 词：电子封装 玻璃通孔 热膨胀性能 玻璃基板 

分 类 号：TQ171[化学工程—玻璃工业]