添加剂HP在复合添加剂中对电解铜箔组织性能的影响  

Effect of additive HP in combination additives on the organizational properties of electrolytic copper foils

作　　者：樊斌锋 程润润 王庆福 朱石林 董玉佳 王坤 Fan Binfeng;Cheng Runrun;Wang Qingfu;Zhu Shilin;Dong Yujia;Wang Kun(Henan High Precision Copper Foil Industry Technology Research Institute Co.,Ltd.,Lingbao 472500,China)

机构地区：[1]河南高精铜箔产业技术研究院有限公司,河南灵宝472500

出　　处：《电镀与精饰》2024年第10期28-33,共6页Plating & Finishing

摘　　要：电解铜箔具有工艺简单、导电导热等力学性能较好的特点,目前已经成为了现代电子行业重要的基础原材料。本研究采用直流电沉积法,以一定量的醇硫基丙烷磺酸钠(HP)、聚乙二醇(PEG)、聚二硫二丙烷磺酸钠(SPS)、糖精钠(BSI)和胶原蛋白作为复合添加剂,研究了不同HP浓度对铜箔表面微观形貌、抗拉强度以及其他物理性能的影响。结果表明:HP在合适的浓度范围内,可以在组合添加剂中与其他添加剂发生协同作用提高(200)和(220)晶面的择优取向,从而有效地细化晶粒,降低粗糙度。当HP在组合添加剂中的浓度为6 mg·L^(−1)时,制备的铜箔其抗拉强度和延伸率分别达到了634.1 MPa和4.1%。Electrolytic copper foil has the characteristics of simple process,good mechanical properties such as conductivity and thermal conductivity,which has become an important basic raw material for the modern electronics industry.In this study,the effects of different HP concentrations on the surface micro-morphology,tensile strength and other physical properties of copper foils were investigated using DC electrodeposition with a certain amount of sodium alcohol thiopropane sulfonate(HP),polyethylene glycol(PEG),sodium polydithiodipropane sulfonate(SPS),sodium saccharin(BSI)and collagen as the composite additives.The results showed that HP can synergize with other additives in the combined additives in a suitable concentration range to improve the optimal orientation of the(200)and(220)grain surfaces,thus effectively refining the grains and reducing the roughness.The tensile strength and elongation of the prepared copper foils reached 634.1 MPa and 4.1%,respectively,when the concentration of HP in the combined additives was 6 mg·L^(−1).

关 键 词：电解铜箔 醇硫基丙烷磺酸钠 聚二硫二丙烷磺酸钠 抗拉强度 

分 类 号：TQ153.14[化学工程—电化学工业]