聚合物三维光子集成芯片的进展与挑战(特邀)  

Advances and Challenges in Polymer Three-Dimensional Photonic Integrated Circuits(Invited)

作　　者：尹悦鑫 张大明[1] Yin Yuexin;Zhang Daming(State Key Laboratory of Integrated Optoelectronics,College of Electronic Science&Engineering,Jilin University,Changchun 130012,Jilin,China)

机构地区：[1]吉林大学电子科学与工程学院,集成光电子学国家重点实验室,吉林长春130012

出　　处：《光学学报》2024年第15期63-76,共14页Acta Optica Sinica

基　　金：国家重点研发计划(2019YFB2203001)。

摘　　要：光子集成芯片在光交叉、光通信、激光雷达领域中得到广泛的研究和应用,为进一步拓展光子芯片的规模和性能,三维光子集成芯片成为研究热点。三维光子集成芯片是指光在波导中传输时,不再限制在二维平面,通过层间耦合或者三维波导的方式实现空间上拓展的一种光子集成芯片。在众多光子平台中,聚合物光子平台是一种灵活、功耗低且性能高的材料平台。由于加工工艺简单、加工成本低,非常适合用于三维光子芯片的加工。着重介绍聚合物三维光子芯片,分别从超快激光加工和多层堆叠两个方面讨论当前的研究进展,最终对存在的问题和可能遇到的挑战进行讨论,并给出可能的解决方案。Significance Photonic integrated circuits(PICs)have been extensively researched and applied in optical interconnections,optical communication,and LiDAR.To further expand the scale and performance of photonic chips,three-dimensional(3D)PICs have emerged as a prominent research focus.3D PICs represent an advanced type of PICs that achieve spatial expansion through coupling or three-dimensional waveguides,allowing light to propagate beyond a two-dimensional plane within the waveguide.Presently,most research and development in 3D PICs is focused on inorganic materials such as silicon,silicon nitride,and high-index silica.The preparation of 3D PICs on these material platforms necessitates polishing processes at the wafer level,which significantly increases fabrication complexity and cost.Among various optical platforms,polymer-based planar lightwave circuits stand out for their flexibility,low power consumption,and high performance.Polymers are cost-effective and can be processed using simple techniques such as spin coating and photolithography.Their fluidity allows for the creation of flat cladding without additional polishing,providing a foundation for multi-layer devices.This fluidity also simplifies hybrid integration with other material platforms.In the field of laser direct writing,many significant works have focused on waveguides based on inorganic materials.While these devices offer clear advantages in terms of propagation loss,they are limited in their capacity for modulation and reconfiguration,which impedes further functional expansion.In recent years,there has been the development of high-performance hybrid integrated photonic devices using unconventional materials such asⅢ-V group material,lithium niobate,and lithium tantalate,in conjunction with conventional silicon waveguides.Three-dimensional integration is regarded as the inevitable path to achieving high-performance hybrid integrated photonic devices.The polymer photonic platform presents a flexible and cost-effective alternative for developing 3D

关 键 词：光子集成回路 三维集成 光通信 光交叉 激光雷达 

分 类 号：O436[机械工程—光学工程]