划片刀磨料粒度分布对不同硅晶圆划切品质的影响  

The Effect of Particle Size Distribution of Dicing Blade Abrasives on the Cutting Quality of Different Silicon Wafers

作　　者：栗云慧 邵俊永 王战 窦文海 黄长羽 付林泊 祝小威 LI Yunhui;SHAO Junyong;WANG Zhan;DOU Wenhai;HUANG Changyu;FU Linbo;ZHU Xizowei(Zhengzhou Research Institute for Abrasives&Grinding Co.,Ltd.,Zhengzhou 45001,China;White Dove Abrasives Co.,Ltd.,Zhengzhou 45001,China)

机构地区：[1]郑州磨料磨具磨削研究所有限公司,河南郑州450001 [2]白鸽磨料磨具有限公司,河南郑州450001

出　　处：《超硬材料工程》2024年第5期26-32,共7页Superhard Material Engineering

摘　　要：为了更好地提升窄街区、小晶粒且街区带有不同修饰材料的硅晶圆的切割品质,研究了划片刀磨料的微小粒度变化和磨料粒度分布宽度对敏感硅晶圆切割品质的影响程度。采用不同粒度及径距微粉制备划片刀并划切表面含聚酰胺胶的窄切缝硅晶圆和表面有二氧化硅钝化层的薄脆硅晶圆。试验表明金刚石磨料粒度相差0.22μm即会对敏感硅晶圆划切的正崩、背崩及刀片磨损速率造成明显影响;粒度分布宽度的收窄有利于改善正崩,但对背崩效果不明显;粒度分布宽度与刀片划切磨损率的是非线性相关的。In order to better improve the cutting quality of silicon wafers with narrow blocks,small grains and blocks with different modification materials,this topic discusses the influence of small differences in diamond particle size and particle size distribution width on the cutting quality of sensitive silicon wafers.The cutting wafers are narrow slit silicon wafers with polyamide adhesive on the surface and thin brittle silicon wafers with silicon dioxide passivation layer on the surface.Experiments have shown that a difference of 0.22μm in diamond abrasive particle size can have a significant impact on the forward and backward breakage of sensitive silicon wafer cutting,as well as the blade wear rate;Narrowing the width of particle size distribution is beneficial for improving normal chip-ping,but it has no significant effect on back chipping;The particle size distribution width is non-linear related to the blade cutting wear rate.

关 键 词：划片刀 粒度分布 崩口 硅晶圆 

分 类 号：TG73[金属学及工艺—刀具与模具] TG74