高功率半导体激光器过渡热沉封装技术研究  

Research on Transitional Heat Sink Packaging Technology for High-Power Semiconductor Lasers

作　　者：周小舒 黄庆 ZHOU Xiaoshu;HUANG Qing(Guilin Julian Technology Co.,Ltd.,Guilin,Guangxi Zhuang Autonomous Region,541004 China)

机构地区：[1]桂林聚联科技有限公司,广西桂林541004

出　　处：《科技资讯》2024年第18期84-86,共3页Science & Technology Information

摘　　要：首先,通过有效改善激光器的热管理和稳定性能,包括热沉设计、封装材料选择、界面优化等,这些措施共同作用于激光器的热管理系统中,以确保激光器在高功率运行下仍能保持稳定和高效的性能。其次,通过热分析和模拟,优化过渡热沉与激光器芯片之间的界面接触,降低接触热阻,提高热传导效率。最后,通过仿真计算和实验验证,评估技术的性能和优化效果。研究表明,这些技术对提高激光器的散热效果和长期稳定性具有重要意义,并推动激光器技术的发展。Firstly,by improving the thermal management and stability performance of lasers,including heat sink de-sign,packaging material selection,interface optimization,etc.,these measures work together in the thermal manage-ment system of the laser to ensure that the laser can maintain stable and efficient performance even under high-power operation.Secondly,through thermal analysis and simulation,it optimizes the interface contact between the transition heat sink and the laser chip,reduces contact thermal resistance,and improves thermal conductivity effi-ciency.Finally,it evaluates the performance and optimization effect of the technology through simulation calcula-tions and experimental verification.Based on this,it is of great significance to improve the heat dissipation effect and long-term stability of lasers,and to promote the development of laser technology.

关 键 词：过渡热沉 高功率半导体激光器 焊料 材料热阻 

分 类 号：TN365[电子电信—物理电子学]