含肉桂酰基自增感光敏聚酰亚胺的合成及光刻工艺探索  

Synthesis of Cinnamoyl-containing Self-enhancing Photosensitive Polyimides and Exploration of Lithographic Processes

作　　者：郭嘉隽 步颜倩 李琇廷 董杰[1] 赵昕[1] 张清华[1] Hui-wen An;Peng Lian;Jin-ping Chen;Tian-jun Yu;Yi Zeng;Yi Li(Key Laboratory of Photochemical Conversion and Optoelectronic Materials,Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing 100190;University of Chinese Academy of Sciences,Beijing 100049)

机构地区：[1]东华大学纤维材料改性国家重点实验室,上海201620

出　　处：《高分子学报》2024年第10期1325-1334,共10页Acta Polymerica Sinica

基　　金：国家重点研发计划课题(项目号2022YFB3603102);中央高校基本科研业务费资助.

摘　　要：以含氟二酐4,4'-(六氟异亚丙基)二邻苯二甲酸酐(6FDA)和含活性羧基的二胺3,5-二氨基苯甲酸(DABA)为单体,通过高温一步法合成可溶性的聚酰亚胺(PI),利用酯化反应在其侧链羧基上接枝自增感光敏基团肉桂酰基.控制6FDA与DABA加入量比例分别合成了3种不同分子量的光敏聚酰亚胺树脂PI95、PI97.5和PI100.系统探究了3种不同分子量光敏聚酰亚胺的光刻工艺参数,并根据光刻图案质量优选出PI97.5样品.PI97.5样品的灵敏度为785 mJ/cm^(2),分辨率可达7μm,线宽可达14μm;固化后薄膜5%失重温度高于340℃,玻璃化转变温度可达274.2℃,且显示出良好的力学性能.研究结果为开发新型负性光敏聚酰亚胺光刻胶提供了研究基础.A soluble polyimide(PI)was synthesized in a high-temperature one-step process using fluorinated dianhydride 4,4'-(hexafluoroisopropylidene)bis(phthalic anhydride)(6FDA)and reactive carboxyl-containing diamine 3,5-diaminobenzoic acid(DABA)as monomers,with the self-enhancing photosensitive cinnamoyl group grafted on the carboxyl group of the PI through the esterification reaction.Three kinds of photosensitive polyimide resins with different molecular weights,PI95,PI97.5 and PI100,were synthesized by controlling the molar ratio of 6FDA to DABA.The photolithographic process parameters of the three kinds of photosensitive polyimides with different molecular weights were systematically explored,and the PI97.5 sample was preferred according to the quality of the photolithographic pattern.The sensitivity of the PI97.5 sample is 785 mJ/cm^(2),the resolution is up to 7μm,and the line width is up to 14μm.The 5% weight loss temperature of the cured film is higher than 340℃,and the glass transition temperature is up to 274.2℃,which shows good mechanical properties.The results provide a research basis for the development of new negative photosensitive polyimide photoresists.

关 键 词：光敏聚酰亚胺 肉桂酰基 自增感 光刻工艺 光敏特性 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]