基于Abaqus的塑封BGA热变形仿真分析  

Simulation Analysis of Thermal Deformation in Plastic-Encapsulated BGA Based on Abaqus

作　　者：李锦勇 彭振飞 朱钟琦 赵洋 LI Jinyong;PENG Zhenfei;ZHU Zhongqi;ZHAO Yang(Wuhan Lingjiu Microelectronics Co.,Ltd.,Wuhan 430000,China)

机构地区：[1]武汉凌久微电子有限公司,武汉430000

出　　处：《微处理机》2024年第5期57-60,共4页Microprocessors

摘　　要：针对塑封BGA芯片因其组分的尺寸、材料参数差异而在焊接过程中易发生翘曲变形的问题,基于有限元分析软件Abaqus对某款塑封BGA进行建模,模拟其在焊接过程中的变形情况。研究计算并分析了三种塑封料及不同厚度基板、塑封料对焊点凝固时芯片变形量的影响。分析结果表明,该芯片变形的计算值与Shadow Moiré实测值相近,进一步揭示出塑封料与基板的热膨胀系数的匹配度以及在一定范围内基板和塑封料的厚度对芯片变形量的影响规律。研究结论有助于更优化地调整材料选型及尺寸比,在设计阶段提高芯片的抗热变形能力。Addressing the issue of warpage deformation in plastic-encapsulated BGA chips during the soldering process due to differences in component sizes and material parameters,the finite element analysis software Abaqus is used to model a specific plastic-encapsulated BGA and simulate its deforma-tion during soldering.The study calculates and analyzes the effects of three types of encapsulation materials and different thicknesses of substrates and encapsulation materials on chip deformation during solder joint solidification.The analysis results show that the calculated deformation values of the chip are close to the measured values using Shadow Moiré,further revealing the influence of the matching degree between the thermal expansion coefficients of the encapsulation material and the substrate,as well as the thickness of the substrate and encapsulation material within a certain range,on the chip deformation.The conclusions help to optimize the adjustment of material selection and dimensional ratios,improving the chip's thermal deformation resistance at the design stage.

关 键 词：芯片变形 ABAQUS软件 热膨胀系数 基板 塑封料 

分 类 号：TN405[电子电信—微电子学与固体电子学]