高孔隙率聚酰亚胺微孔膜的制备及其介电性能  

Preparation of high-porosity polyimide microporous films and their dielectric properties

作　　者：马姣姣 刘培奇 郭贝贝 郭海泉[1] MA Jiaojiao;LIU Peiqi;GUO Beibei;GUO Haiquan(Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China)

机构地区：[1]中国科学院长春应用化学研究所,吉林长春130022

出　　处：《绝缘材料》2024年第10期34-41,共8页Insulating Materials

基　　金：福建省科技计划项目(2022T3057)。

摘　　要：以3,3′,4,4′-联苯四甲酸二酐(BPDA)和4,4′-二氨基-2,2′-二甲基-联苯(mTB)为单体,加入致孔剂,利用热致相分离原理,控制聚酰胺酸的高温热亚胺化过程,制备高孔隙率聚酰亚胺薄膜,并对薄膜的微孔形貌、力学性能及介电性能等进行分析。结果表明:多孔薄膜的孔隙率可达50%~60%,其中试样PI-1-250-4 h在10 GHz下的介电常数为2.14,介质损耗因数为0.0028,同时保持了良好的力学性能和耐热性。由于刚性联苯结构单元的引入,多孔薄膜仍然保持了较低的热膨胀系数。将多孔薄膜与热塑性聚酰亚胺(TPI)复合,高温压合铜箔后,所组成的无胶双面覆铜板具有较好的界面粘接性和耐焊锡性,可应用于高频高速挠性覆铜板领域。Polyimide films with high porosity were prepared using 3,3′,4,4′-biphenyltetracarboxylic dianhydride(BPDA)and 4,4′-diamino-2,2′-dimethyl-biphenyl(mTB)as monomers.During the preparation process,pore-forming agent was added into the system,and the high-temperature thermal imidization of polyamide acid was controlled by the principle of thermo-induced phase separation.The micropore morphology,mechanical properties,and dielectric properties of the films were analyzed.The results show that the porosity of porous films reach 50%−60%.Under the frequency of 10 GHz,the dielectric constant and the dielectric loss factor of the sample PI-1-250-4 h is 2.14 and 0.0028,respectively,while maintaining good mechanical properties and heat resistance.Due to the introduction of rigid biphenyl building blocks,the porous film still maintains a low coefficient of thermal expansion.The adhesive-free double-sided copper clad laminate,which prepared by combining the porous film with thermoplastic polyimide(TPI)and then pressing copper foil at high temperature,has good interface adhesion and solder resistance,and can apply to high-frequency and high-speed flexible copper clad laminates.

关 键 词：聚酰亚胺 多孔膜 介电常数 覆铜板 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]