微弹簧型CCGA器件植装工艺及评价方法  

Column Planting Process and Evaluation Methods of Micro-Spring CCGA Devices

作　　者：张振越 周洪峰 吉勇 朱家昌 Zhang Zhenyue;Zhou Hongfeng;Ji Yong;Zhu Jiachang(Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China;The 58th Research Institute,CETC,Wuxi 214035,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035 [2]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《半导体技术》2024年第11期1023-1029,共7页Semiconductor Technology

摘　　要：微弹簧型焊柱以其更好的抗振动、抗温度循环、耐冲击性能将替代高铅焊柱和铜带缠绕焊柱成为未来陶瓷柱栅阵列(CCGA)封装的新选择。针对当前国内微弹簧型CCGA器件工艺研究与评价方法稀缺的现状,以微弹簧型CCGA2577器件为实验对象,开展了植装工艺与评价方法研究,提出了适用于微弹簧型CCGA器件的拉脱强度和剪切强度的测试方法与强度修正方法。结果表明,微弹簧型CCGA2577器件焊柱的焊点空洞率、剪切强度、拉脱强度均满足GB/T 36479—2018和GJB 548C—2021的判据要求。本文提出的植装工艺与评价方法能够有效指导微弹簧型CCGA器件的封装加工与质量评价。The micro-spring column will replace Pb90/Sn10 plain column and copper wrap column as a new choice for ceramic column grid array(CCGA)packaging in the future because of its better antivibration,anti-temperature cycle and anti-impact properties.In order to make up for the lack of process research and evaluation methods of micro-spring CCGA devices in China,by taking the micro-spring CCGA2577 devices as experimental objects,the research on column planting process and evaluation methods was carried out,and the test methods for tensile strength and shear strength and the strength correction method of micro-spring CCGA devices were put forward.The results show that the void area percentage of solder joints,shear strength and tensile strength for the column of micro-spring CCGA2577 devices meet the criteria requirements of GB/T 36479—2018 and GJB 548C—2021.The column planting process and evaluation method proposed in this paper can effectively guide the packaging processing and quality evaluation of micro-spring CCGA devices.

关 键 词：微弹簧 陶瓷柱栅阵列(CCGA) 植装工艺 拉脱强度 空洞率 

分 类 号：TN305.94[电子电信—物理电子学]