厚铜印制电路板压合技术探讨  

Discussion on pressing technology of heavy copper PCB

作　　者：李秋梅 蓝春华 范伟名 LI Qiumei;LAN Chunhua;FAN Weiming(Kinwong Electronic Technology(Longchuan)Co.,Ltd.,Heyuan 517373,Guangdong,China;Metal-based Printed Circuit Board Engineering Technology Research and Development Center in Guangdong Province,Heyuan 517373,Guangdong,China;Heyuan Key Laboratory of High Density and High Heat Dissipation Circuit Board,Heyuan 517373,Guangdong,China)

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517373 [2]广东省金属基印制电路板工程技术研究开发中心,广东河源517373 [3]河源市高密度高散热电路板企业重点实验室,广东河源517373

出　　处：《印制电路信息》2024年第11期51-54,共4页Printed Circuit Information

摘　　要：厚铜板具有承载大电流、减少热应变和散热性好的特性,被广泛应用。厚铜PCB在完成压合时,由于厚铜层的铜较厚、不合适选择半固化片(PP),及压合过程中PP流胶或排气不顺畅,都有可能会发生压合后填胶不足,进而导致层间空洞、分层等品质问题。针对厚铜板在制作中的压合工艺中容易造成品质风险的问题,从设计、工艺制作上进行分析与验证,为厚铜电路板产品制作提供参考。Heavy copper PCB is made of heavy copper foil or ultra-heavy copper foil.The conductive materials and substrate materials used,the production process,and the application field of heavy copper PCB are different from those of the conventional PCB.Heavy copper PCB is widely used because of its high current load,excellent thermal stability,good heat dissipation,good signal integrity,high reliability and strong customization.Pressing is the key process of heavy copper PCB.Aiming at the problem that the quality risk is easy to be caused in the pressing process of heavy copper PCB,this paper analyzes and verifies the design and process to provide reference for the production of heavy copper circuit board products.

关 键 词：厚铜PCB 压合 半固化片 空洞与分层 

分 类 号：TN41[电子电信—微电子学与固体电子学]