考虑温度效应的胶接接头力学性能及失效机理  

Mechanical Properties and Failure Mechanism of Adhesive Joints with Temperature Effect

作　　者：金希红 曹琼方 魏杨 何宗锴 JIN Xi-hong;CAO Qiong-fang;WEI Yang;HE Zong-kai(The State Key Laboratory of Heavy-duty and Express High-power Electric Locomotive,Zhuzhou 412001,China;State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle,Hunan University,Changsha 410082,China)

机构地区：[1]重载快捷大功率电力机车全国重点实验室,株洲412001 [2]湖南大学整车先进设计制造技术全国重点实验室,长沙410082

出　　处：《科学技术与工程》2024年第29期12497-12505,共9页Science Technology and Engineering

基　　金：中车株洲电力机车有限公司科技研发项目(2022KJ108)。

摘　　要：为研究胶黏剂、基板材料和环境温度对胶接接头力学性能的影响,以单搭接胶接接头为研究对象,对其准静态拉伸力学性能开展了试验研究。研究结果表明,环氧树脂胶黏剂的黏接强度明显优于聚氨酯胶黏剂,但聚氨酯胶接接头呈现出良好的延性。基板材料的差异会影响胶接接头的整体强度,铝基板在搭接区易发生塑性变形从而导致失效进程加快,接头强度降低。随着温度的升高,胶接接头的强度和刚度均发生了下降,但降幅与胶黏剂的型号相关,这主要与胶黏剂的玻璃化转变温度有关。此外,环境温度对接头的失效模式产生了影响,在高温下,接头更易于发生界面破坏。研究结果为单搭接胶接接头在汽车实际服役环境中的应用提供了更全面的参考。In order to study the effects of adhesive,substrate material and ambient temperature on the mechanical properties of the adhesive joint,the quasi-static tensile mechanical properties of the single lap adhesive joint were studied.The results show that the bonding strength of epoxy resin adhesive is better than that of polyurethane adhesive,but the polyurethane adhesive shows good ductility.The differences of substrate materials would affect the strength of the adhesive joint.The plastic deformation at the lap end of aluminum substrate would accelerate of the failure process of adhesive layer,leading to the reduction of the joint strength.With the increase of temperature,the strength and stiffness of the adhesive joint decreases,but the decrease is related to the type of adhesive.It is mainly related to the glass transition temperature of the adhesive.In addition,the failure mode of the joint is affected by the ambient temperature.At high temperature,the joint is more prone to adhesive failure.The study provides a more comprehensive guidance for the application of single lap adhesive joint in the actual service environment of automobiles.

关 键 词：胶接接头 胶黏剂 基板材料 温度 失效模式 

分 类 号：TB333[一般工业技术—材料科学与工程]