塑封器件声学扫描(SAM)中的特殊结构判断分析  

Analysis of Special Structures in Acoustic Scanning(SAM)of Plastic Encapsulated Devices

作　　者：聂延伟 NIE Yanwei(Xi'an Xigu Microelectronics Co.,Ltd.,Shaanxi 710077,China)

机构地区：[1]西安西谷微电子有限公司,陕西710077

出　　处：《电子技术（上海）》2024年第8期38-39,共2页Electronic Technology

摘　　要：阐述声学扫描显微镜检查是检测塑封器件内部分层的最佳检测手段。介绍声学扫描显微镜检查的原理、封装塑封器件分层的识别方法。针对塑封器件芯片表面不规则涂覆层误判问题,提出验证方法。This paper describes that acoustic scanning microscopy is the best detection method for detecting internal delamination in plastic encapsulated devices.It introduces the principle of acoustic scanning microscopy inspection and the identification method of delamination in encapsulated plastic devices.It proposes a verification method for the misjudgment problem of irregular coating layers on the surface of plastic encapsulated device chips.

关 键 词：集成电路 声学扫描检查 特殊结构 塑封器件 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN406