射频系统先进封装技术研究进展  

Research progress of advanced packaging technology for radio frequency system

作　　者：吴磊 WU Lei(The 10th Research Institute of China Electronics Technology Corporation,Chengdu 610036,China;Sichuan Engineering Technology Research Center for Electricity Interconnect of Electronic Information Equipment,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036 [2]四川省电子信息装备电气互联工程技术研究中心,四川成都610036

出　　处：《电子元件与材料》2024年第9期1053-1062,共10页Electronic Components And Materials

摘　　要：通信、雷达和微波测量等领域电子信息装备迅速发展,对射频系统提出了微型化、集成化和多样化等迫切需求。先进封装技术可以将不同材料、不同工艺和不同功能的器件进行异质集成,极大提升了电子产品的功能、集成度和可靠性等方面,成为推动射频系统发展的关键引擎。本文概述了芯片倒装、扇出封装、2.5D封装和三维堆叠这四种先进封装互联技术在射频系统封装中的最新研究进展,并从结构集成度、工艺实现性和信号传输等角度对不同封装结构进行了剖析。最后,分析了当前射频系统先进封装技术发展所面临的挑战,并从协同设计、高效散热和新封装技术等方面探讨了未来的发展方向。The rapid development of electronic information equipment in the fields of communication,radar,and microwave measurement has put forward urgent needs for miniaturization,integration,and diversification of radio frequency(RF)systems.Advanced packaging technology can heterogeneously integrate the devices with different materials,fabrication processes,and functions,greatly improving the functionality,integration level,and reliability of electronic products.As a result,advanced packing is a pivotal engine driving the development of RF systems.This article overviews the latest research progress on four advanced packaging technologies for RF system packaging,namely,flip-chip packaging,fan-out packaging,2.5D packaging,and 3D stacking.Different packaging structures are analyzed from the perspectives of structural integration,process feasibility,and signal transmission.Finally,the encountered challenges are analyzed during the development of advanced packaging technologies for RF systems,and future development directions are discussed from the perspectives of collaborative design,efficient heat dissipation,and new packaging technologies.

关 键 词：射频系统 先进封装 综述 芯片倒装 扇出封装 2.5D封装 三维堆叠 

分 类 号：TN305.94[电子电信—物理电子学]