添加Sb对Sn-9Zn-3Bi/Cu钎料接头显微组织及力学性能的影响  

Effect of Sb addition on the microstructure and mechanical properties of Sn-9Zn-3Bi/Cu solder joints

作　　者：涂文斌[1] 吴鸿燕 梅琪 王韩冰 吴吉洋 颜文俊 TU Wenbin;WU Hongyan;MEI Qi;WANG Hanbing;WU Jiyang;YAN Wenjun(Jiangxi Key Laboratory of Forming and Joining Technology for Aerospace Components,Nanchang Hangkong University,Nanchang 330063,China;College of Naval Engineering,Jiangxi Polytechnic University,Jiujiang 332007,Jiangxi Province,China)

机构地区：[1]南昌航空大学江西省航空构件成形与连接重点实验室,江西南昌330063 [2]江西职业技术大学船舶工程学院,江西九江332007

出　　处：《电子元件与材料》2024年第9期1154-1160,1166,共8页Electronic Components And Materials

基　　金：江西省自然科学基金(20232BAB204052)。

摘　　要：采用钎料合金化研究添加Sb对Sn-9Zn-3Bi无铅焊点组织、熔点特性、润湿性、金属间化合物(IMC)厚度和剪切强度的影响。结果表明:钎料的熔点随Sb含量的增加而略微上升,钎料的铺展面积随Sb含量的增加从50.3 mm^(2)降低至36.6 mm^(2);添加Sb虽然没有改变焊点处钎料基体和界面IMC的显微组织类型,但细化了焊点显微组织,且焊点界面处的IMC厚度从18.6μm降低至16.8μm。随着钎料中Sb含量从0增加到1.5%(质量分数),Sn-9Zn-3Bi/Cu接头剪切强度从22.7 MPa增加到29.8 MPa,剪切强度的提高是显微组织细化、固溶强化及界面处IMC厚度降低共同作用的结果。The effect of Sb addition was investigated on the microstructures,melting characteristics,wettability,thickness of intermetallic compounds(IMC),and shear strength of the Sn-9Zn-3Bi lead-free solder joints.The results show that the melting point of the solder increases slightly as the Sb content increases,and the spreading area decreases from 50.3 mm^(2)to 36.6 mm^(2)at higher Sb content.Although the addition of Sb does not vary its microstructure,it refines the microstructure of the solder joints.Furthermore,the thicknesses of IMC also decreases from 18.6μm to 16.8μm as the Sb content increases from 0 to 1.5%(mass fraction).The shear strength of Sn-9Zn-3Bi/Cu solder joint increases from 22.7 MPa to 29.8 MPa as the Sb content increases from 0 to 1.5%,which is synergic results of microstructure refinement,solution strengthening and the reduction of IMC thickness.

关 键 词：无铅钎料 SB 显微组织 剪切强度 

分 类 号：TG425[金属学及工艺—焊接]