K频段小型化四通道天线接口单元设计与实现  

Design and Implementation of K-Band Miniaturized Four-Channel Antenna Interface Unit

作　　者：钟鸣海 ZHONG Minghai(Southwest China Institute of Electronic Technology,Chengdu 610036,China)

机构地区：[1]中国西南电子技术研究所,四川成都610036

出　　处：《压电与声光》2024年第5期690-694,共5页Piezoelectrics & Acoustooptics

摘　　要：为了适应机载射频前端小型化的需求,设计了一种基于SiP(System in Package)技术的K频段四通道天线接口单元。该单元采用二次超外差变频构架,主要由两个硅基封装的变频双通道集成SiP模块以及高低本振集成锁相环SiP模块组成。硅基变频SiP模块采用PoP(Package on Package)方式实现不同功能电路封装的上下堆叠,保证了良好的电磁兼容和输出杂散抑制。堆叠好的硅基封装通过BGA植入陶瓷封装中,实现了高可靠的气密性。基于SiP技术的四通道天线接口单元体积仅为58.2 mm×40.3 mm×11.0 mm,在保持优良电性能指标前提下,相比于传统方式设计,四通道天线接口单元在体积和质量上均大幅缩减86%以上,在机载、弹载等对设备轻小型化要求较高的平台上具有广阔的应用前景。To meet the miniaturization requirements of airborne RF front ends,a K-band four-channel antenna interface unit was designed based on the System in Package(SiP)technology.A secondary superheterodyne frequency conversion framework was adopted in the proposed unit.Thus,the unit was mainly composed of two silicon-based dual-channel integrated SiP modules and two integrated phase-locked loop SiP modules.The silicon-based frequency conversion SiP module realized the stacking of different functional circuit packages with the Package on Package(PoP)architecture.It ensured good electromagnetic compatibility and achieved output spurious suppression.Moreover,the stacked silicon-based packages were implanted in the ceramic package via BGA to achieve highly reliable airtightness.Based on SiP technology,the volume of the four-channel antenna interface unit was merely 58.2 mm×40.3 mm×11.0 mm.Along with achieving excellent electrical performance,the volume and weight of the proposed unit were significantly reduced by more than 86%compared to a traditional antenna interface unit.Hence,the proposed unit has significant application potential on platforms with rigorous lightweight and miniaturization demands,such as airborne and missile-borne platforms.

关 键 词：四通道天线接口单元 硅基MEMS 陶瓷封装 SIP POP 

分 类 号：TN925[电子电信—通信与信息系统]