Advancements in transfer printing techniques for flexible electronics:adjusting interfaces and promoting versatility  

作　　者：Zijian Chen Chi Zhang Zijian Zheng 

机构地区：[1]School of Fashion and Textiles,The Hong Kong Polytechnic University,Hong Kong Special Administrative Region of China,People’s Republic of China [2]Department of Applied Biology and Chemical Technology,The Hong Kong Polytechnic University,Hong Kong Special Administrative Region of China,People’s Republic of China [3]State Key Laboratory for Ultra-Precision Machining Technology,The Hong Kong Polytechnic University,Hong Kong Special Administrative Region of China,People’s Republic of China [4]Research Institute for Intelligent Wearable Systems,The Hong Kong Polytechnic University,Hong Kong Special Administrative Region of China,People’s Republic of China [5]Research Institute for Smart Energy,The Hong Kong Polytechnic University,Hong Kong Special Administrative Region of China,People’s Republic of China

出　　处：《International Journal of Extreme Manufacturing》2024年第5期95-117,共23页极端制造（英文）

基　　金：financial support from the RGC Senior Research Fellowship Scheme(SRFS2122-5S04);General Research Fund(15304322);RGC Postdoctoral Fellowship(PDFS2324-5S10);State Key Laboratory for Ultraprecision Machining Technology(1-BBXR).

摘　　要：The burgeoning interest in flexible electronics necessitates the creation of patterning technology specifically tailored for flexible substrates and complex surface morphologies.Among a variety of patterning techniques,transfer printing emerges as one of the most efficient,cost-effective,and scalable methods.It boasts the ability for high-throughput fabrication of 0–3D micro-and nano-structures on flexible substrates,working in tandem with traditional lithography methods.This review highlights the critical issue of transfer printing:the flawless transfer of devices during the pick-up and printing process.We encapsulate recent advancements in numerous transfer printing techniques,with a particular emphasis on strategies to control adhesion forces at the substrate/device/stamp interfaces.These strategies are employed to meet the requirements of competing fractures for successful pick-up and print processes.The mechanism,advantages,disadvantages,and typical applications of each transfer printing technique will be thoroughly discussed.The conclusion section provides design guidelines and probes potential directions for future advancements.

关 键 词：transfer printing flexible electronics ADHESION interfacial adjujstments 

分 类 号：TS805[轻工技术与工程]