有机添加剂对超低轮廓电解铜箔性能的影响  

Effects of organic additives on properties of hyper very low profile electrolytic copper foil

作　　者：宋言 朱若林 陈岩 SONG Yan;ZHU Ruolin;CHEN Yan(Jiangxi Copper Corporation Limited,Jiangxi Provincial Key Laboratory of Rare and Scattered Metals Materials,Nanchang 330096,China;Jiangxi Copper Technology Research Institute Co.,Ltd.,Nanchang 330096,China;Jiangxi JCC Copper Foil Technology Co.,Ltd.,Nanchang 330096,China)

机构地区：[1]江西铜业集团有限公司稀贵稀散金属材料江西省重点实验室,江西南昌330095 [2]江西铜业技术研究院有限公司,江西南昌330096 [3]江西省江铜铜箔科技股份有限公司,江西南昌330096

出　　处：《电镀与涂饰》2024年第11期24-31,共8页Electroplating & Finishing

基　　金：赣鄱俊才支持计划--主要学科学术和技术带头人培养项目支持(20232BCJ22028)。

摘　　要：[目的]研究电解液中聚二硫二丙烷磺酸钠(SPS)和胶原蛋白(QS)质量浓度对超低轮廓(HVLP)电解铜箔性能的影响。[方法]采用以SPS为光亮剂、QS为整平剂及含有四氢噻唑硫铜(H1)的电解液电沉积制备了HVLP铜箔。研究了SPS和QS质量浓度不同时所得HVLP铜箔毛面的光泽度、粗糙度、力学性能、形貌和组织结构。[结果]SPS和QS的质量浓度都显著影响着HVLP铜箔的性能。随着SPS和QS质量浓度的增大,铜箔的抗拉强度先升后降,断裂伸长率先降后升,铜箔上Cu(200)晶面的择优取向增强,表面由沟壑状向平坦化转变。SPS和QS的质量浓度在2~8 mg/L范围内变化时所得铜箔性能均满足要求。[结论]通过调整电解液中SPS或QS的质量浓度均能制备出高光泽、低粗糙度的HVLP铜箔。[Introduction]The effects of mass concentrations of sodium dithiodipropanesulfonate(SPS)and collagen(QS)in electrodeposition electrolyte on properties of hyper very low profile(HVLP)electrolytic copper foil need to be studied.[Method]HVLP electrolytic copper foil were prepared by electrodeposition in a tetrahydrothiazolyl thione(H1)containing electrolyte with SPS as brightener and QS as leveling agent.The glossiness,roughness,mechanical properties,morphology,and microstructure at matte side of HVLP copper foils electroplated at different mass concentrations of SPS and QS were studied.[Result]Both the mass concentrations of SPS and QS had a great impact on the properties of HVLP copper foil.With the increasing of mass concentration of SPS or QS,the tensile strength of copper foil was increased initially and then decreased,the variation of elongation at break was opposite to the tensile strength,the preferred orientation of Cu(200)crystal plane was enhanced,and the surface morphology was transformed from gully-like to flat.The properties of HVLP copper foils obtained within 2 to 8 mg/L of SPS or QS met the requirements of practical applications.[Conclusion]HVLP copper foils with high glossiness and low roughness can be electrodeposited by adjusting the mass concentration of SPS or QS in electrolyte.

关 键 词：电解铜箔 超低轮廓 粗糙度 抗拉强度 晶面取向 

分 类 号：TQ153.14[化学工程—电化学工业]