电子封装用纳米级无铅钎料的研究进展  

Research Progress of Nanoscale Lead-free Solder in Electronic Packaging

作　　者：黄玺 张亮 王曦 陈晨 卢晓 HUANG Xi;ZHANG Liang;WANG Xi;CHEN Chen;LU Xiao(School of Materials Science and Engineering,Xiamen University of Technology,Xiamen 361024,Fujian,China;School of Mechatronic Engineering,Jiangsu Normal University,Xuzhou 221116,Jiangsu,China)

机构地区：[1]厦门理工学院材料科学与工程学院,福建厦门361024 [2]江苏师范大学机电工程学院,江苏徐州221116

出　　处：《材料导报》2024年第23期132-144,共13页Materials Reports

基　　金：厦门理工学院高层次人才研究启动项目(YKJ22054R);福建省“闽江学者”特聘教授人才项目。

摘　　要：随着电子工业的不断发展,封装技术呈现出多功能化、高密度、高集成的发展趋势。焊点作为连接芯片和基板的重要一环,其强度和可靠性面临着巨大的挑战。近年来,随着纳米科技的兴起,许多研究者尝试将钎焊材料的尺寸缩小至纳米级,纳米级钎料的热稳定性、导电性、润湿性等一些方面的性能与常规钎料相比有着不同程度的提高。本工作总结了近年来研究较多的几种纳米钎料的制备方法,重点分析了以化学还原法为主导的纳米级钎料的制备工艺;通过分析纳米SnAgCu、SnAg、SnBi、烧结Ag钎料显微组织的演化,总结了钎料纳米化后的改性机理;最后还讨论了现阶段钎料纳米化难以突破的问题以及不足之处,为纳米无铅钎料的进一步研究提供理论支撑。With the continuous development of the electronics industry,packaging technology presents the development trend of multi-function,high density and high integration.The solder joint plays an important interconnection between chip and substrate,faces great challenges in strength and reliability.In recent years,with the rise of nanotechnology,many researchers tried to reduce the size of soldering materials to nanometer level for modification.The investigations show that the thermal stability,conductivity,wettability and other properties of the nanoscale sol-ders are improved in different degrees compared with the conventional solders.In this work,several preparation methods of nano-brazing metal which have been widely used in recent years are summarized and the preparation process of nano-brazing metal dominated by chemical reduction method is emphatically analyzed,by analyzing the microstructure evolution of SnAgCu,SnAg,SnBi and Ag-sintered solder,the modification mechanism summarized.Finally the problems that are difficult to break through in the field of solder nanocrystallization and the shortcomings are discussed,which can provide theoretical support for further research of nanoscale lead-free solders.

关 键 词：电子封装 纳米级钎料 制备工艺 改性机理 

分 类 号：TG42[金属学及工艺—焊接]