多层PCB互连应力测试技术及实验验证  

Multilayer PCB Interconnect Stress Test Technology and Experimental Validation

作　　者：石博宇 邓二平 陈庆国 施卢军 吴立信 丁立健 Shi Boyu;Deng Erping;Chen Qingguo;Shi Lujun;Wu Lixin;Ding Lijian(School of Electrical Engineering and Automation,Hefei University of Technology,Hefei 230009,China;Energy Research Institute of Hefei Comprehensive National Science Center,Hefei 230009,China;National Center of Quality Inspection&Testing for Printed Circuit Board,Tongling 244000,China;Shenzhen Test Integration Technology Co.,Lid.,Shenzhen 518100,China)

机构地区：[1]合肥工业大学电气与自动化工程学院,合肥230009 [2]合肥综合性国家科学中心能源研究院,合肥230009 [3]国家印制电路板质量检验检测中心,安徽铜陵244000 [4]深圳市泰斯特尔系统科技有限公司,广东深圳518100

出　　处：《半导体技术》2024年第12期1153-1164,共12页Semiconductor Technology

摘　　要：随着新能源汽车车载充电机效率和功率的逐步提升,对印制电路板(PCB)的可靠性提出了更高的要求。分析了测试基本原理以及目前国内外的研究现状,依据IPC-TM-6502.6.26:2014中测试方法A提出的测试标准对研制的设备进行互连应力测试(IST)。基于IST原理,分析测试中样品的失效机理,找到需要监控的主要变量。并介绍了四线制测量电路、温度校准等难点。在温度校准中,电阻温度系数会影响样品温度的准确性,因此该变量尤为重要。进行了大量测试,以验证本设备的功能完整性以及使用过程中的稳定性和安全性。此外,使用本设备与IPC标准中指定的IST设备进行了对比测试。测试结果表明,本设备在控制保护程序、数据处理及温度校准方面相比于参考设备更具优势。With the gradual enhancement of the efficiency and power of on-board chargers in new energy vehicles,higher requirements have been imposed on the reliability of printed circuit boards(PCBs).The basic principle of testing and the current research status at home and abroad were analyzed,and the interconnect stress test(IST)was performed on the developed equipment according to the test standard proposed in test method A of IPC-TM-6502.6.26:2014.Based on the IST principle,the failure mechanism of the samples in the test was analyzed to identify the main variables that need to be monitored.And difficulties such as the four-wire measurement circuit and temperature calibration were introduced.In temperature calibration,the resistance temperature coefficient can affect the accuracy of the sample temperature,making this variable particularly crucial.The functional integrity,and stability and safety during the usage of this equipment were verified through extensive tests.Additionally,comparative tests were conducted between this equipment and the IST equipment specified in the IPC standard.The test results indicate that this equipment holds greater advantages in the aspects of control and protection procedures,data processing and temperature calibration compared with the reference equipment.

关 键 词：印制电路板(PCB) 电镀通孔 互连结构 互连应力测试 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN407