纳秒/皮秒激光加工CaSiO_(3) LTCC的可行性对比研究  

Comparative Study on Feasibility of Nanosecond/Picosecond Laser Processing CaSiO_(3) LTCC

作　　者：谢明君 韦佳伟 肖何 赵俊熠 陈妮 Xie Mingjun;Wei Jiawei;Xiao He;Zhao Junyi;Chen Ni(The 54th Research Institute of China Electronics Technology Corporation,Shijiazhuang 050000,China;不详)

机构地区：[1]中国电子科技集团公司第五十四研究所,石家庄市050000 [2]中国电子科技集团公司第十六研究所 [3]南京航空航天大学

出　　处：《工具技术》2024年第12期10-17,共8页Tool Engineering

基　　金：国家重点研发计划(2020YFA0709700)。

摘　　要：围绕硅酸钙低温共烧陶瓷叠层基板难加工的问题,对比纳秒和皮秒激光加工对CaSiO_(3) LTCC的影响、激光作用后的成分以及不同激光参数下CaSiO_(3) LTCC的烧蚀特性,通过硬度变化评价两种激光加工的可行性。结果表明:两种激光加工后的区域皆呈现出粉末层及重铸层的叠加,重铸层产物均为CaSiO_(3),皮秒激光加工后的形貌优于纳秒加工后的形貌;纳秒和皮秒的烧蚀深度分别在97.2~442.6μm和161.7~461.7μm范围内,随激光功率的增加以及速度和填充间距的减小,烧蚀深度基本呈线性增加的趋势,激光功率是影响烧蚀深度的主要因素;皮秒激光作用后的表面粗糙度整体比纳秒激光更低,化学铣切后最小可达6.41μm;纳秒作用后表面热影响区硬度分别下降72.0%~77.2%,较皮秒激光加工更利于后续机加工处理。This paper focuses on the difficult processing of calcium silicate low temperature co-fired ceramic laminated substrates,compares the effects of nanosecond and picosecond laser processing on CaSiO_(3) LTCC,as well as the composition after laser action and the ablation characteristics of CaSiO_(3) LTCC under different laser parameters,and finally evaluates the feasibility of the two types of laser processing through the change of hardness.The results show that:the areas after both laser processing show the superposition of powder layer as well as recast layer,and the products of recast layer are CaSiO_(3),and the morphology after picosecond laser processing is better than that after nanosecond processing;the ablation depths of nanoseconds and picoseconds are in the ranges of 97.2~442.6μm and 161.7~461.7μm,respectively.With the increase of the laser power,and the decreases of the velocity and filling spacing,the ablation depth is basically linearly increasing.The laser power is the main factor affecting the ablation depth.The surface roughness at the top and bottom of the groove after picosecond laser action are overall lower than that of nanosecond laser,with a minimum of 6.41μm after chemical milling,whereas the hardness of the heat-affected zone on the surface after nanosecond action is reduced by 72.0%~77.2%,respectively,which is more favorable for subsequent machining treatment than that of picosecond laser processing.

关 键 词：纳秒激光 皮秒激光 CaSiO_(3)LTCC 粗糙度 维氏硬度 

分 类 号：TG665[金属学及工艺—金属切削加工及机床] TH16[机械工程—机械制造及自动化]