电子电镀中的新工艺和新技术分析  

Analysis of New Processes and Technologies in Electronic Electroplating

作　　者：张华平 ZHANG Huaping(Jinan Jingheng Electronics Co.,Ltd.,Shandong 250306,China)

机构地区：[1]济南晶恒电子有限责任公司,山东250306

出　　处：《电子技术（上海）》2024年第9期94-95,共2页Electronic Technology

摘　　要：阐述电子电镀新工艺,包括对芯片电镀、电化学机械研磨、微机电系统电镀、不溶性阳极电镀铜自动线、镀铂铌电极的介绍。分析无铅无镉磷光亮化学镀镍、碱性蚀刻液再生与铜回收系统技术形式。This paper describes the new technology of electronic electroplating, including chip electroplating, electrochemical mechanical grinding, microelectromechanical system electroplating, insoluble anode electroplating copper automatic line, and platinum niobium electrode plating. Analyze the technical forms of lead-free, cadmium free, and phosphorus bright chemical nickel plating, alkaline etching solution regeneration, and copper recovery systems.

关 键 词：电子电镀 电化学 铜回收 

分 类 号：TG174[金属学及工艺—金属表面处理]