高压蒸煮后塑封电路漏电分析  

Analysis of Plastic Encapsulated Microcircuits Leakage Current after Pressure Cooking Test

作　　者：陈光耀 朱冠政 祁立鑫 CHEN Guang-yao;ZHU Guan-zheng;QI Li-xin(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035)

机构地区：[1]中国电子科技集团公司第五十八研究所,无锡214035

出　　处：《环境技术》2024年第11期170-175,共6页Environmental Technology

摘　　要：塑封电路易受水气侵蚀,发生塑封料分层、金属化层腐蚀等现象,造成电路性能退化,甚至失效。为保证其可靠性,通常采用温度、湿度加速应力试验——高压蒸煮(PCT)进行考核,是塑封电路试验项目之一。某塑封电路高压蒸煮后进行电性能测试时发生漏电失效现象,通超声扫描显微镜、扫描电子显微镜(SEM)、能谱仪(EDS)等设备,对失效电路进行形貌、成分、电性能分析,并通过比对试验验证了失效机理。结果表明:在高温高湿环境下,塑封电路表面存在的杂质离子与水形成电解液,使得引脚锡镀层发生腐蚀反应,腐蚀离子在塑封体表面迁移、结晶生长,生成膜状锡氧化物,形成漏电通道,导致高压蒸煮试验后漏电失效。Plastic encapsulated microelectronics(PEMs)are susceptible to moisture intrusion,leading to phenomena such as delamination of the encapsulating material and corrosion of the metal layer,resulting in the degradation of circuit performance and even failure.To ensure their reliability,temperature and humidity accelerated stress tests-Pressure Cooker Test(PCT),are commonly conducted as part of the evaluation process for PEMs.In this study,a plastic device exhibited leakage failure during electrical performance testing after undergoing PCT.Variousequipments were employed to analysis the morphology and element,such as SEM,EDS,XRD and other equipment,to explore the causation of corrosion,and the leakage failure mechanism of the PEMs after PCT was determined.Finally,the failure mechanism was verified by comparing quadruple sample,and the verification results were consistent with failure phenomena.The results indicate that in a high-temperature,high-humidity environment,impurity ions present on the surface of the PEMs form an electrolyte with water.This leads to a corrosion reaction of the tin plating on the pins,with the corroded ions migrating and crystallizing on the surface of the packaging,forming a film of tin oxide.This film creates a leakage path,causing leakage failure after PCT.

关 键 词：塑封电路 高压蒸煮 镀层 腐蚀 漏电 

分 类 号：TN406[电子电信—微电子学与固体电子学]