硅烷偶联剂对高速高频板用RTF铜箔剥离强度的影响  

Effect of silane coupling agent on peel strength of RTF copper foil for high speed and high frequency plate

作　　者：尹卫华 张妞妞 王海振 王维河 Yin Weihua;Zhang Niuniu;Wang Haizhen;Wang Weihe(HKC Co.,Ltd,Taiyuan HuiKe New Materials Co.,Ltd,Taiyuan 030000,China)

机构地区：[1]惠科股份有限公司太原惠科新材料有限公司,山西太原030000

出　　处：《电镀与精饰》2024年第12期101-106,共6页Plating & Finishing

摘　　要：随着信息化科技的飞速发展,高频高速板用铜箔正朝着低粗糙度和高剥离强度的方向发展,传统高粗糙度的标准铜箔(HTE)已不再满足要求,这就诞生了低粗糙度的反转铜箔(RTF)。RTF铜箔是对铜箔光面进行粗化处理,采用SEM、抗拉强度测试仪、剥离强度测试仪、粗糙度仪等来表征RTF铜箔物性,主要从硅烷偶联剂角度来提高RTF铜箔与高频高速板材(988G)之间的剥离强度。分别对含有氨基、环氧基、乙烯基及巯基的活性官能团硅烷进行研究,发现乙烯基三甲氧基硅烷(KBM-1003)与988G板材之间具有更高的黏结强度,当KBM-1003水溶液浓度为2g/L、温度为25~35℃、pH值为3.0~4.0时,涂覆后的RTF铜箔与988G板材之间具有较高的剥离强度。With the rapid development of information technology,the high-frequency and high-speed plate copper foil is developing towards the direction of low roughness and high peel strength,and traditional high roughness standard copper foil(HTE)no longer meets the requirements,which gives birth to the low roughness reverse treated copper foil(RTF).RTF copper foil coarses the smooth surface of copper foil.SEM,tensile strength tester,peel strength tester and roughness meter are used to characterize the physical properties of RTF copper foil.The peel strength between RTF copper foil and high-frequency high-speed plate(988G)is mainly improved from the Angle of silane coupling agent.The active functional silanes containing amino group,epoxy group,vinyl group and sulfhydryl group were studied respectively.It was found that vinyl tri-methoxysilane(KBM-1003)and 988G sheet have higher bond strength.When the concentration of KBM-1003 aqueous solution is 2 g/L,the temperature is 25-35,℃and the pH value is 3.0-4.0,the bond strength is higher.The coating RTF copper foil and 988G sheet have high peeling strength.

关 键 词：高频高速板 低粗糙度 RTF铜箔 乙烯基三甲氧基硅烷 

分 类 号：TQ153.1[化学工程—电化学工业]