铜箔表面处理方式对插入损耗的影响  

Effect of copper foil surface treatment on insertion loss

作　　者：高冠正 房兰霞 陈祝华 Gao Guanzheng;Fang Lanxia;Chen Zhuhua

机构地区：[1]上海美维科技有限公司,上海201613 [2]安捷利美维电子(厦门)有限公司,福建厦门361026

出　　处：《印制电路资讯》2024年第6期84-86,共3页Printed Circuit Board Information

摘　　要：随着PCB产品朝着高频高速发展,其信号传输过程更容易出现信号完整性问题。插入损耗是衡量信号完整性的重要指标。铜箔作为一种重要的电子材料,被广泛用作PCB产品的导体材料,是影响产品插入损耗的重要因素之一。本文研究对比了铜箔粗糙度相同(生箔和粗化处理一致),但其表面处理方式(金属化处理与非金属化处理两种方式)不同的两款铜箔的插入损耗结果,研究表明非金属化处理后的铜箔有较低的插入损耗。With the development of PCB products towards high frequency and high speed,its signal transmission process is more prone to signal integrity problems.Insertion loss is an important index to measure signal integrity.As an important electronic material,copper foil is widely used as a conductor material for PCB products,and is one of the important factors affecting the insertion loss of products.In this paper,the insertion loss results of two copper foils with the same raw foil and coarsening treatment methods(the copper foil has the same roughness)but different surface treatment methods(metallization treatment and nonmetallic treatment)are compared.The research shows that the copper foils with the nonmetallic treatment method have lower insertion loss.

关 键 词：PCB 信号完整性 铜箔 插入损耗 表面处理 磁性金属 

分 类 号：TN4[电子电信—微电子学与固体电子学]