高散热无胶膜铝基板的设计及性能研究  

Research on the Design and Performance of Aluminum Substrates Without Polymer Adhesive Film for High Thermal Conductivity

作　　者：李军 秦会斌[1] LI Jun;QIN Huibin(School of Electronics and Information,Hangzhou Dianzi University,Hangzhou 310018,China)

机构地区：[1]杭州电子科技大学电子信息学院,杭州310018

出　　处：《材料导报》2024年第S02期345-347,共3页Materials Reports

摘　　要：铝基覆铜板是应用最广的一类金属基散热基板,铝基板通过阳极氧化后原位生成的氧化铝薄膜中孔隙率较大,这会造成基板导热耐压等性能下降。常规的用无机盐封孔法含有重金属元素,生产和应用受限。为此,本工作提出聚合物封孔法,通过用两种分子链较短的环氧树脂以及搭配金属氧化物颗粒来填充阳极氧化铝薄膜孔隙,比较得到提升铝板导热和耐压性能效果较高的样品。结果表明,该方法得到的铝基板具有高导热性能和良好的耐压性能,导热系数最高达38.7812 W/(m·K),而且该方法环保,操作简便,也为使用有机化合物和金属氧化物颗粒对铝基板阳极孔隙进行封闭以制备高导热和耐电压性能无胶膜铝基覆铜板提供了实验基础。Aluminum-based copper clad laminate is the most widely used type of metal-based heat dissipation substrate,and the pority of the alumina film generated in situ after anodizing of the aluminum substrate is large,which will cause the performance of the substrate to decrease in thermal conductivity and voltage endurance.The conventional method of sealing with inorganic salts contains heavy metal elements,and its production and application are limited.Therefore,a polymer sealing method was proposed,in which two epoxy resins with shorter molecular chains and metal oxide particles were used to fill the pores of anodized aluminum films,and the samples with high effect on improving the thermal conductivity and voltage withstand of aluminum plates were compared.The results show that the aluminum substrate obtained by this method has high thermal conductivity and good voltage endurance performance,and the thermal conductivity is up to 38.7812 W/(m·K).Moreover,the method is environmentally friendly and easy to operate,and also provides an experimental basis for the feasibility of using organic compounds and metal oxide particles to seal the anode pores of aluminum substrates to prepare aluminum-based copper-clad laminates without adhesive film with high thermal conductivity and voltage resistance.

关 键 词：铝基板 阳极氧化 环氧树脂 金属氧化物颗粒 高导热性 

分 类 号：TB332[一般工业技术—材料科学与工程]