一种高多层服务器主板制作初探  

Exploration on the production of a high multi layer motherboard for server

作　　者：孟昭光 MENG Zhaoguang(Dongguan Wuzhu Electronic Technology Co.,Ltd.,Dongguan 523000,Guangdong,China;Guangdong Printed Circuit Board(Wuzhu)Engineering Technology Research Center,Dongguan 523000,Guangdong,China)

机构地区：[1]东莞市五株电子科技有限公司,广东东莞523000 [2]广东省印制电路板(五株)工程技术研究中心,广东东莞523000

出　　处：《印制电路信息》2024年第12期48-54,共7页Printed Circuit Information

摘　　要：重点介绍一款应用于AI服务器领域的高速材料R-5775(G)与高T_(g)材料R1755V混压结构的30层背板样品制作方法。其产品主要特点有:高层次(30层)、高板厚(3.8±0.38 mm),高纵横比(13.5∶1)、高精密以及混压结构。重点评估了工厂重点工序现有制程能力,介绍了该产品的工程设计、工艺特性技术难点及解决方案。In this paper,a method of making 30⁃layer backplane sample of high-speed material R-5775(G)and high-T_(g) material R1755V mixed-pressure structure applied in the field of AI server is introduced.The main features of the product are:high multi⁃layer(30 layers),high plate thickness(3.8±0.38 mm),high aspect ratio(13.5:1),high precision and mixed-pressure structure.The existing process capability of key process is evaluated,and the engineering design,technical difficulties and solutions of the product are introduced.

关 键 词：AI服务器 介电常数 介电损耗 树脂塞孔 背钻 

分 类 号：TN41[电子电信—微电子学与固体电子学]