微光机电引信芯片光纤抗高过载设计方法  

Anti-high-overload Design of Micro-optical-electro-mechanical Fuze Chip Fiber

作　　者：张笑 谢晋 曹骏 代俊 张德[1] ZHANG Xiao;XIE Jin;CAO Jun;DAI Jun;ZHANG De(Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China;State Key Laboratory of Mechatronical Engineering and Control,Beijing Institute of Technology,Beijing 100081,China)

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900 [2]北京理工大学机电工程与控制国家级重点实验室,北京100081

出　　处：《探测与控制学报》2024年第6期29-36,45,共9页Journal of Detection & Control

摘　　要：针对微光机电系统(MOEMS)芯片在中大口径榴弹炮引信中的应用需求,提出一种MOEMS封装方法。通过在光纤槽部分设计光纤定位结构,实现光纤的被动对准,光纤对准后在芯片外部使用环氧胶对光纤进行轴向的可靠固定。采用ANSYS Workbench软件对光纤定位结构进行有限元仿真分析,通过力锤试验与高速离心试验完成光纤光路的抗高过载能力测试。仿真与试验结果表明,封装后的光纤光路在勤务处理意外跌落环境与正常发射环境中均能实现光能的稳定传输,对于推动MOEMS技术在中大口径榴弹炮引信中的应用具有一定意义。Considering the application requirement of micro-optical-electro-mechanical systems(MOEMS)chip in the medium and large caliber howitzer fuze,a MOEMS packaging method was proposed.The optical fiber positioning structure was designed in the fiber groove to realize the passive alignment of the optical fiber.After the optical fiber alignment,the optical fiber was reliably fixed axially by using epoxy adhesive outside the chip.The finite element simulation analysis of the fiber positioning structure was carried out by ANSYS Workbench software,and the anti-high-overload capability of the optical path was tested by force hammer test and high speed centrifugal test.The results of simulation and test indicated that the packaged fiber optical path can achieve stable transmission of light energy in both the service processing unexpected drop environment and the normal launch environment,which was of important significance to promote the application of MOEMS technology in the medium and large caliber howitzer fuze.

关 键 词：微光机电系统 引信 光纤 高过载 封装 

分 类 号：TJ43[兵器科学与技术—火炮、自动武器与弹药工程]