微米级Ag/Cu/Ni球形颗粒对Sn_(42)Bi_(58)焊料性能的影响  

Influence of Micro Sized Ag/Cu/Ni Spherical Particles on the Properties of Sn_(42)Bi_(58) Solder

作　　者：万莉 WAN Li(Shanghai Electronic Information Vocational and Technical College,Shanghai 201411,China)

机构地区：[1]上海电子信息职业技术学院,上海201411

出　　处：《电子工业专用设备》2024年第6期20-26,共7页Equipment for Electronic Products Manufacturing

摘　　要：研究了微米级银粉、镍粉和铜粉对Sn_(42)Bi_(58)无铅焊锡膏的焊接性能影响。在实验过程中通过机械搅拌的方式添加金属粉末,明显改善Sn-Bi合金焊接头的焊接能力和力学性能。并对其组织与性能进行了研究,为低温无铅焊料的推广和产业化奠定了材料基础。The influence of micron sized silver powder,nickel powder,and copper powder on the soldering performance of Sn_(42)Bi_(58) lead-free solder paste is studied.During the experiment,metal powder is added by mechanical stirring,which significantly improved the welding ability and mechanical properties of Sn Bi alloy welded joints.And its organization and properties are studied,laying the material foundation for the promotion and industrialization of low-temperature lead-free solder.

关 键 词：微米金属颗粒 锡铋合金 偏析 焊料 

分 类 号：TG425.2[金属学及工艺—焊接]