基于标记点识别的晶圆自动扫正方法研究  

Research on Wafer Automatic Aligning Method Based on Markers Recognition

作　　者：胡奇威 左宁[1] 袁丽娟 张光宇 包敖日格乐 HU Qiwei;ZUO Ning;Yuan Liyuan;ZHANG Guangyu;BAO Aorigee(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2024年第6期32-37,共6页Equipment for Electronic Products Manufacturing

摘　　要：自动探针测试系统是硅晶圆半导体前道检测工艺中的关键设备之一,用来测量不同类型器件的多种电性能参数(如功率器件静态参数、微波器件S参数等)。在实际工艺线上,由于人为操作误差和外界环境干扰因素,探针台在测试前,必须对晶圆进行校准。针对这一问题,创新性地提出了一种基于标记点图像识别的晶圆自动扫正方法。经过验证,该方法校准精度高,工艺适应性强。Automatic probe test system is one of key equipment in the front end inspection process of silicon wafer semiconductor,which is used to measure various electrical performance parameters of different types of devices(such as static parameters of power devices,S parameters of microwave devices,etc.).In the actual process line,due to human error and external environment interference and other factors,the probe station must be aligned before the test.In order to solve this problem,an innovative method of wafer automatic aligning based on marked points image recognition is proposed in this paper.After verification,the method has high calibration accuracy and strong process adaptability.

关 键 词：探针测试系统 晶圆扫正 图像识别 测试工艺 

分 类 号：TN307[电子电信—物理电子学]