三维集成电子封装中TGV技术及其器件应用进展  

Review on TGV technology and its application in three-dimensional integrated electronic packaging

作　　者：张迅 王晓龙 李宇航 行琳 刘松林 阳威 洪华俊 罗宏伟[4] 王如志[1] ZHANG Xun;WANG Xiaolong;LI Yuhang;XING Lin;LIU Songlin;YANG Wei;HONG Huajun;LUO Hongwei;WANG Ruzhi(Key Laboratory of Advanced Functional Materials of Education Ministry of China,Institute of New Energy Materials and Devices,College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China;WG Tech(Jiang Xi)Co.,Ltd.,Xinyu 338004,Jiangxi Province,China;TGV Circuit Technology(Hubei)Co.,Ltd.,Tianmen 431700,China;The Fifth Institute of Electronics,Ministry of Industry and Information Technology,Guangzhou 510610,China)

机构地区：[1]北京工业大学材料科学与工程学院新能源材料与技术研究所新型功能材料教育部重点实验室,北京100124 [2]江西沃格光电股份有限公司,江西新余338004 [3]湖北通格微电路科技有限公司,湖北天门431700 [4]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子元件与材料》2024年第10期1190-1198,共9页Electronic Components And Materials

基　　金：国家重点研发计划(2021YFB3500403)。

摘　　要：在三维(3D)集成电路中,层间电路封装及其互联互通主要依赖于垂直通孔结构,这是其突破传统二维集成电路布局的核心与关键。近年来,玻璃通孔(TGV)技术由于具备低成本、高性能、易于加工和应用前景广阔等优点,日益引起了科研人员和电子厂商们的关注与重视。首先综述了TGV技术的性能优势、工艺特点、制备方法及关键技术。在此基础上,总结了TGV技术在三维集成无源器件(IPD)、集成天线封装、微机电系统(MEMS)封装以及多芯片模块封装等多个三维集成电子封装领域中的应用进展。基于此,进一步展望了TGV技术在未来三维集成电子封装中的发展方向与应用前景。In three-dimensional(3D)integrated circuits,through-via interconnects are pivotal for layer-to-layer packaging and connectivity,which is critical for breaking through the traditional two-dimensional integrated circuit layout.Lately,through glass via(TGV)technology has garnered significant interest from researchers and manufacturers due to its compelling benefits,such as low cost,superior performance,easy fabrication,and diverse applicability.This article first gives an indepth review of the TGV technology on the performance merits,process specificities,manufacturing methods,and key technologies.Subsequently,it summarizes the burgeoning applications of the TGV technology in 3D integrated electronic packaging,encompassing 3D Integrated Passive Devices(IPD),integrated antenna packaging,Micro-Electro-Mechanical Systems(MEMS),and multi-chip module packaging.Finally,the future development directions and applications of the TGV technology in3D integrated electronic packaging are further prospected.

关 键 词：电子封装 三维集成电路 综述 玻璃通孔技术 垂直互联 成孔 孔填充 

分 类 号：TN405[电子电信—微电子学与固体电子学]