温变环境下引脚互连结构长期可靠性研究及优化  

Research and Optimization of Long-term Reliability of Pin-interconnect Structure in a Temperature-varying Environment

作　　者：谢东 周玉明 黄军 XIE Dong;ZHOU Yuming;HUANG Jun(The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2024年第4期699-704,共6页Microelectronics

摘　　要：基于陶瓷基板-金属管壳引脚互连结构,通过温度循环试验与有限元仿真分析,得出了互连结构在温变荷载作用下的热应力分布图,研究结果表明:在长期温度循环试验后,互连结构产生裂纹的主要原因是焊锡、引脚与陶瓷基板之间热膨胀系数不匹配导致的应力积累。给出了引脚互连结构优化设计方案,通过仿真分析与试验研究,表明优化后的互连结构具有更高的长期可靠性。Using a ceramic substrate-metal shell pin interconnection structure,the thermal stress distribution of the interconnect structure under temperature-varying loads was obtained via a temperature cycling test and finite element simulation.The results showed that the stress accumulation caused by the mismatch of the thermal expansion coefficient between the solder,pin,and ceramic substrate was the main reason for the crack formation in the interconnect structure after a long-term temperature cycling test.The optimization design of the pin-interconnect structure was proposed in this study.We showed that the optimized interconnect structure has high long-term reliability via simulation analysis and experiments.

关 键 词：互连结构 热应力 长期可靠性 有限元分析 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]