钛阴极板组织均匀化处理及其表面电解铜箔的组织结构  

Microstructure homogenization treatment of titanium plate as cathode and microstructure of electrolytic copper foil electrodeposited thereon

作　　者：吴亚楠 王明飞 曾靖雯 李子庆 WU Ya’nan;WANG Mingfei;ZENG Jingwen;LI Ziqing(College of Energy Engineering,Huanghuai University,Zhumadian 463000,China)

机构地区：[1]黄淮学院能源工程学院,河南驻马店463000

出　　处：《电镀与涂饰》2024年第12期32-38,共7页Electroplating & Finishing

基　　金：河南省自然科学基金项目(232300421212)。

摘　　要：[目的]电解铜箔是通过在阴极表面电沉积所得,是阴极表面晶体结构的延续,因此提高阴极表面组织均匀性有利于提高电解铜箔的性能。[方法]通过焊接、热处理、轧制和退火对钛阴极板进行组织均匀化处理,再电沉积得到铜箔。对比了自制电解铜箔与商用压延铜箔的微观组织和性能差异。[结果]经组织均匀化处理后,钛板的晶粒得以细化,平均取向差减小,晶粒度等级提高至10级。使用该钛板作为阴极电沉积制备所得铜箔的晶面取向以(220)为主,平均纳米硬度为0.39 GPa,高于压延铜箔的纳米硬度(0.22 GPa)。与商用压延铜箔相比,自制电解铜箔的致密度更低,表面更粗糙,但其晶粒取向分布更均匀。[结论]自制电解铜箔的致密度和表面平整度不理想,后期可通过调整镀液添加剂和电沉积工艺参数来改善。[Introduction]The electrolytic copper foil electrodeposited on the surface of cathode is a continuation of the crystal structure of cathode surface.Therefore,it is beneficial for enhancing the performance of electrolytic copper foil by improving the surface structure uniformity of the cathode.[Method]The titanium plate was firstly subjected to homogenization treatment through welding,heat treatment,rolling,and annealing,and then electroplated with copper,forming copper foil thereon.The differences in microstructure and properties between homemade electrolytic copper foil and commercial rolled copper foil were compared.[Result]After homogenization treatment,the grains of titanium plate were refined,the average orientation deviation was reduced,and the grain size was improved to grade 10.The copper foil prepared by electroplating using the treated titanium plate as cathode featured a crystal orientation mainly of(220),and an average nanohardness of 0.39 GPa,which was higher than that of a commercial rolled copper foil(0.22 GPa).As compared with commercial rolled copper foil,the homemade electrolytic copper foil was less compact and rougher,but more uniform in grain orientation distribution.[Conclusion]The compactness and surface smoothness of the homemade electrolytic copper foil are not ideal,but can be improved later by adjusting the additives in bath and the electroplating process parameters.

关 键 词：电解铜箔 钛板 微观组织 纳米硬度 致密度 

分 类 号：TQ153.14[化学工程—电化学工业]