纯钛表面状态对电解铜箔形核机制的影响  

The Influence of Surface State of Pure Ti on the Nucleation Mechanism of Electrolytic Copper Foil

作　　者：戎万 杨斌 冯庆 王轶[1] 贾波 张乐 操齐高[1] RONG Wan;YANG Bin;FENG Qing;WANG Yi;JIA Bo;ZHANG Le;CAO Qigao(Northwest Institute for Non-Ferrous Metal Research,Xi'an 710016,China;School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Xi'an Taijin Xinneng Technology Co.,Ltd.,Xi'an 710021,China)

机构地区：[1]西北有色金属研究院,陕西西安710016 [2]河南科技大学材料科学与工程学院,河南洛阳471023 [3]西安泰金新能科技股份有限公司,陕西西安710021

出　　处：《中国材料进展》2024年第12期1111-1117,共7页Materials China

基　　金：国家重点研发计划资助项目(2021YFB3400800);陕西省重点研发计划资助项目(2023-YBGY-170)。

摘　　要：针对钛阴极辊表面电沉积铜箔的高质量要求,主要开展纯钛片晶粒度和表面状态对电解铜箔初始沉积层形核和生长影响规律的研究。形貌和成分分析结果表明,较高的晶粒度更有利于铜核快速形成,铜核优先在缺陷处形成,并逐渐长大连接成片;较大的粗糙度可使铜核快速长大,而随着粗糙度的减小,铜核会在更多的位置形成,但长大后的尺寸减小。电化学分析结果表明,适当粗糙度的钛片具有更高的耐蚀性和电荷转移能力。此外,COMSOL建模结果证明钛片表面的尖端位置具有较高的电流密度与较大的铜箔沉积厚度,电流密度和沉积厚度随着距离钛片表面的尖端位置越远而变得更小。通过研究铜箔初始沉积层的形核和生长机制,可以为钛阴极辊的制备提供理论指导,即增大钛阴极辊的晶粒度、适当减小表面粗糙度和避免尖端区域的形成对于制备厚度均匀、表面平整的电解铜箔至关重要。In response to the high-quality requirements for electrodepositing copper foil on the surface of titanium cathode roller,this article mainly conducts research on the influence of grain size and surface state of pure Ti on the nucleation and growth of the initial deposition layer of electrolytic copper foil.Characterization results of morphology and composition indicate that a higher grain size grade is more conducive to the rapid formation of copper nuclei,which preferentially form at the defect site and gradually grow and connect into pieces;a larger roughness can cause copper nuclei to grow rapidly,and as the roughness decreases,copper nuclei will form at more positions,but their size decreases as roughness grow.Electrochemical analysis results indicate that the Ti sheets with appropriate roughness have higher corrosion resistance and charge transfer ability.In addition,the results of COMSOL modeling demonstrate that the tip position on the surface of Ti sheets has a higher current density and a larger copper foil deposition thickness,and the current density and deposition thickness become smaller as the distance from the tip position on the surface of Ti sheets increases.This article provides theoretical guidance for the preparation of titanium cathode roller by studying the nucleation and growth mechanism of the initial deposition layer of copper foil.Increasing the grain size grade of titanium cathode roller,appropriately reducing surface roughness,and avoiding the formation of tip region are crucial for the preparation of electrolytic copper foils with uniform thickness and smooth surface.

关 键 词：钛阴极辊 电解铜箔 晶粒度 粗糙度 初始沉积层 

分 类 号：TQ153.14[化学工程—电化学工业]