基于系统级封装技术的X频段变频模块研制  

Development of X-band RF transceiver module with system in package technology

作　　者：麻泽龙 吴景峰[1] 余小辉[1] Ma Zelong;Wu Jingfeng;Yu Xiaohui(The 13th Research Institute of China Electronics Technology,Shijiazhuang 050000,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050000

出　　处：《电子技术应用》2024年第12期105-111,共7页Application of Electronic Technique

摘　　要：研制了一款利用系统级封装技术(SIP)的小体积X频段双通道收发变频模块,在其内部集成了采用不同工艺制成的器件。模块把发射通道和接收通道集成到一个腔体中,并实现收发分时控制。模块采用上下双腔结构,不同腔体之间采用BGA球栅阵列进行垂直连接,显著减小模块体积,模块体积为21 mm×16 mm×3.8 mm。模块主要指标测试结果为:接收通道输入P-1dB≤-10 dBm,接收信号增益30~35 dB,接收通道隔离度大于等于55 dB,接收噪声系数小于等于8 dB;发射通道增益10~12 dB,发射通道最大输出功率大于等于12 dBm,二次三次谐波抑制大于等于60 dBc,杂波抑制大于等于55 dBc,模块可在-55~+85℃正常工作。实测结果与仿真结果基本一致。A miniaturized X-band dual-channel radio frequency(RF)transceiver module is designed by using system in package(Sip)technology,which integrates devices based on a variety of process.Receiving channel and transmitting channel are inte-grated into a cavity,and time-sharing control for transmitting and receiving is achieved.Double-cavity structure is used and dif-ferent cavities are vertically interconnected through the ball grid arrays to reduce the module size significantly.The size of SIP module is 21 mm×16 mm×3.8 mm.The main measured technical specifications of the modules are as follows:The P_(-1),dB of re-ceiving channel≤-10 dBm,receiving signal gain 30~35 dB,isolation degree of the receiving channel≥55 dB,receiving noise figure≤8 dB;gain of transmission channel 10~12 dB,maximum output power of transmission channel≥12 dBm,second and third harmonic suppression≥60 dBc,clutter rejection≥55 dBc,the module can function properly within the temperature range of-55~+85 C.The measured results are basically agreed with the simulation results.

关 键 词：X频段 收发系统 系统级封装 BGA球栅阵列 

分 类 号：TN72[电子电信—电路与系统]