高耐热覆铜板的设计及性能研究  

Design and performance of high heat-resistant copper-clad plate

作　　者：罗以聪 秦会斌[1] LUO Yi-cong;QIN Hui-bin(Institute of Electron Device&Application,Hangzhou Dianzi University,Hangzhou 310018,China)

机构地区：[1]杭州电子科技大学,新型电子器件与应用研究所,浙江杭州310018

出　　处：《热固性树脂》2024年第6期15-19,共5页Thermosetting Resin

摘　　要：在双酚F环氧树脂中添加不同比例的联苯型环氧树脂(YX4000)与聚氨酯改性环氧树脂(SL3403)得到三元共混体系,通过红外光谱、玻璃化转变温度测试研究了该共混体系的固化反应及耐热性。再在三元共混体系添加不同粒径大小的氧化铝制备了覆铜板,并对覆铜板的热稳定性、耐热性、剥离强度及耐电压性进行了测试。结果表明,当YX4000和SL3403在树脂体系中的质量分数均为20%时,体系的综合性能最佳,此时T_(g)为195℃,5%失重温度为381℃,覆铜板的288℃漂锡时间为1 023 s,剥离强度为1.305 N/mm,击穿电压为49 V/μm。The ternary blending system was obtained by adding different proportions of biphenyl epoxy resin(YX4000)and polyurethane modified epoxy resin(SL3403)to bisphenol F epoxy resin.The curing reactions and heat resistance of the blended system were studied by infrared spectroscopy and glass transition temperature test.The copper clad laminates were prepared by adding alumina with different particle sizes in the ternary blending system,and the thermal stability,heat resistance,peel strength and voltage resistance of the copper clad laminates were tested.The results showed that when the mass fractions of YX4000 and SL3403 in the resin system was both 20%,the overall performance of the system was the best.In this case,the T_(g),5%weight loss temperature,tin bleaching time of the copper-clad board at 288 C,peel strength and breakdown voltage was 195℃,381℃,1023 s,1.305N/mm and 49 V/μ,respectively.

关 键 词：覆铜板 联苯型环氧树脂 聚氨酯 热稳定性 耐高温 剥离强度 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]