基于铝基板的PCB焊接工艺研究  

Research on PCB Welding Process Based on Aluminum Substrate

作　　者：张广泰 徐小飞 闫继豪 陆凯雷 彭晨 ZHANG Guangtai;XU Xiaofei;YAN Jihao;LU Kailei;PENG Chen

机构地区：[1]常州博瑞电力自动化设备有限公司,江苏常州213025 [2]南京南瑞继保电气有限公司,江苏南京211102

出　　处：《今日自动化》2024年第10期103-105,共3页Automation Today

摘　　要：随着电子技术的快速发展,对电子设备的性能要求越来越高。铝基板由于其良好的热导性、自重轻及成本较低的特点,在高性能电子设备中得到了广泛应用。然而,铝基板的PCB焊接工艺存在一些技术难题,如焊接性能不稳定、焊点质量难以控制等。鉴于此,研究了基于铝基板的PCB焊接工艺,通过试验论证焊接工艺参数,为提高铝基板PCB焊接质量提供了理论依据和实践指导。With the rapid development of electronic technology,the performance requirements for electronic devices are becoming increasingly high.Aluminum substrates have been widely used in high-performance electronic devices due to their excellent thermal conductivity,light weight,and relatively low cost.However,there are some technical difficulties in the PCB soldering process of aluminum substrates,such as unstable soldering performance and difficult control of solder joint quality.In view of this,the PCB welding process based on aluminum substrate was studied,and the welding process parameters were experimentally demonstrated,providing theoretical basis and practical guidance for improving the welding quality of aluminum substrate PCB.

关 键 词：铝基板 PCB焊接 焊接工艺参数 焊接质量 

分 类 号：TN41[电子电信—微电子学与固体电子学]