利用去湿现象制备图案化的离子刻蚀聚合物保护层  

Fabrication of Patterned Polymer Resists for Ion Etching by Using Dewetting

作　　者：陆广[1] 曹召良[2] 卢振武[2] 李伟[1] 姚计敏[1] 张刚[1] 杨柏[1] 沈家骢[1] 

机构地区：[1]吉林大学超分子结构与材料教育部重点实验室,化学学院,长春130023 [2]中国科学院长春光学精密机械与物理研究所,应用光学国家重点实验室,长春130022

出　　处：《高等学校化学学报》2002年第12期2390-2392,共3页Chemical Journal of Chinese Universities

基　　金：国家自然科学基金 (批准号 :5 0 0 730 0 7);重大基础研究计划 (批准号 :G 2 0 0 0 0 7810 2 );国家教育部博士点基金资助

摘　　要：A novel method using a combination of microcontact printing(μCP) technique, surface-directed condensation and surface- directed dewetting has been developed to fabricate patterned polymer films on gold substrates. These patterned polymer films can serve as resists in the argon ion etching effectively to transfer patterns into the underlying gold substrates. This method is flexible in controlling the shape and feature size of the patterns in the polymer resists by simply adjusting the concentration of polymer solution, and especially it also provides a route to sub-micrometer sized features by using an original template with micrometer sized features.A novel method using a combination of microcontact printing(μCP) technique, surface-directed condensation and surface- directed dewetting has been developed to fabricate patterned polymer films on gold substrates. These patterned polymer films can serve as resists in the argon ion etching effectively to transfer patterns into the underlying gold substrates. This method is flexible in controlling the shape and feature size of the patterns in the polymer resists by simply adjusting the concentration of polymer solution, and especially it also provides a route to sub-micrometer sized features by using an original template with micrometer sized features.

关 键 词：支湿现象 制备 聚合物保护层 聚合物薄膜 微接触印刷 自组装单层膜 离子刻蚀 表面图案化 

分 类 号：TN305.7[电子电信—物理电子学] TB38[一般工业技术—材料科学与工程]