空间超流氦中低温界面热阻最佳热耦合研究  

Optimum coupling of interfacial thermal resistance at low temperature in space superfluid helium

作　　者：张亚黎[1] 王惠玲[1] 徐虹玲[1] 黄良璧[2] 

机构地区：[1]华中科技大学能源与动力工程学院 [2]中国计量科学研究院热力参量研究室

出　　处：《华中科技大学学报（自然科学版）》2002年第11期66-68,共3页Journal of Huazhong University of Science and Technology(Natural Science Edition)

摘　　要：针对红外探测器与制冷元器件的接触中低温界面热阻最佳热耦合问题 ,分析了两固体接触面的情况 ,认为接触热阻是一个受材料性质、表面粗糙度、负载、温度、介质、表面氧化物膜和环境等众多因素影响的非线性问题 ,在此基础上制作了Al Cu超导热开关 ,电子显微镜观测结果表明 ,接触界面不是一个简单的几何面 ,而是一个具有纳米级厚度的三维“界面层” .Interfacial thermal resistance optimum coupling for infrared detectors and refrigeration apparatus in space superfluid helium at low temperature was discussed. Two solid contact interfaces were analyzed and interfacial thermal resistance was considered to be a non linear problem influenced by the property, roughness, load, temperature, medium, oxide film and environment of the material. The superconducting heat switch of A1 Cu was done and the diffusivity on the copper side of the aluminum and the aluminum side of the copper measured by SEM. It is thought that the contact interface is not a simple interface, but a three dimensional interface layer with nano scale thickness.

关 键 词：空间超流氦 低温界面热阻 最佳热耦合 接触界面 接触热阻 接触导热 

分 类 号：TK124[动力工程及工程热物理—工程热物理]