基于多层微带基板的收发变频通道设计  

Design on T/R Frequency Conversion Channel based on Multilayer Microstrip Substrate

作　　者：祝加秀[1] 刘鲁军[1] 范鹏飞[1] 

机构地区：[1]华东电子工程研究所,安徽合肥230088

出　　处：《工业技术创新》2016年第5期956-959,共4页Industrial Technology Innovation

摘　　要：为实现对S波段收发变频通道中的直流传输、数字控制信号、射频传输的电磁兼容特性优化设计,基于Protel软件对收发变频通道进行了PCB版图级设计,并利用HFSS软件对本振垂直过渡进行了仿真。基于多层微带基板的微带结构、带状线结构的本振传输设计,重点完成了变频模块的小型化设计,并对垂直互联结构的电特性进行了仿真研究,给出了收发通道的测试结果。设计有效提升了电路组装效率,降低了生产成本。In order to carry out optimum design for electromagnetic compatibility of direct current transmission,digital control signal and radio frequency transmission in S-band transmission and receive(TV R) frequency conversion channel,layout design of PCB is carried out for it based on the Protel software,and local oscillator vertical transition is simulated based on the HFSS software.Also,based on the local oscillator design for microstrip/strip structures of multilayer microstrip substrate,the miniaturization design of frequency conversion module is completed,and the electrical characteristics of the vertical interconnection structure are simulated.The test results of T/R frequency conversion effectively imply that the assembly efficiency of circuit is improved,and the production cost is reduced.

关 键 词：收发通道 变频 SIP封装 多层微带基板 射频垂直过渡 仿真分析 

分 类 号：TN957[电子电信—信号与信息处理]