封装焊点蠕变-疲劳寿命预测模型研究综述  

A Review of Creep-Fatigue Models in Solder Joints

作　　者：邢睿思 王龙[1] 侯传涛[1] XING Ruisi;WANG Long;HOU Chuantao(Science and Technology on Reliability and Environmental Engineering Laboratory,Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所可靠性与环境工程技术重点实验室,北京100076

出　　处：《强度与环境》2024年第6期1-11,共11页Structure & Environment Engineering

基　　金：国家自然科学基金(12402077);重点实验室基金(WDZC20220201)。

摘　　要：新型微互连与三维封装技术不断推动航天电子产品向高性能、小型化方向发展,封装焊点作为结构薄弱环节从毫米级向微米级转化,加剧了焊点失效问题的严重性,需要深入理解焊点失效机理,完善焊点寿命预测模型,提升焊点可靠性评估水平。本文梳理了材料蠕变-疲劳寿命预测基础理论,总结了热循环载荷下焊点寿命预测模型的具体形式与模型特点,分析了蠕变-疲劳载荷下模型的预测能力与存在的问题,为深入理解焊点疲劳寿命预测理论,发展预测精度高、适配性强的焊点寿命预测模型提供基础。Micro-interconnection and 3D packaging technology promote the rapid development of aerospace electronic products to high-performance and miniaturization.As the weak link of package structure,solder joints develop from millimeter to micron,which enhance the severity of solder joints failure.In order to improve the reliability of the package structure,it is essential to investigate the failure mechanism and life prediction model of solder joints.In this paper,the basic theory of creep fatigue life prediction and life prediction models of solder joints were summarized.Prediction capabilities of life prediction models were analyzed,which was important to improve the understanding of life prediction theory under creep fatigue conditions,and establish the life prediction model with high accuracy and applicability.

关 键 词：封装焊点 蠕变-疲劳 寿命预测模型 焊点可靠性 

分 类 号：V416.5[航空宇航科学与技术—航空宇航推进理论与工程]