96%氧化铝陶瓷基板成型工艺研究  

Study on Forming Process of 96%Alumina Ceramic Substrate

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作  者:徐先豹 刘瑞祥[1] 王营营[1] 刘佳 张萌 王伟伟 隋松林 汤群辉 XU Xian-Bao;LIU Rui-Xiang;WANG Ying-Ying;LIU Jia;ZHANG Meng;WANG Wei-Wei;SUI Song-Lin;TANG Qun-Hui(Shandong Industrial Ceramic Research&Design Institute Co.,Ltd.,Zibo 255000,China)

机构地区:[1]山东工业陶瓷研究设计院有限公司,山东淄博255000

出  处:《现代技术陶瓷》2024年第6期520-529,共10页Advanced Ceramics

摘  要:氧化铝陶瓷由于性价比高,是目前应用最广泛的陶瓷基板材料,随着未来LED照明产品的发展,LED封装将逐步模块化、标准化,提供具有高散热性和精密尺寸的散热基板,是未来LED行业发展的趋势。本研究在96%氧化铝陶瓷基板注凝成型工艺基础上,采用一种压力注凝成型工艺,研究压力对坯体平整度以及密度的影响,主要进行配方体系、注凝成型压力和烧成制度等相关工艺技术研究,解决相关技术难题,同时研究普通注凝成型和压力注凝成型相同烧成温度下不同部位的收缩率变化。结果表明:当压力为0.030~0.032 MPa时,坯体密度差异小于0.16%,平整度更好,烧成后制品的变形较小,收缩率变化更小,各部位密度均匀性更好。alumina ceramics due to high cost performance,is currently the most widely used ceramic substrate material,with the future development of LED lighting products,LED packaging will gradually modular,standardized,to provide high heat dissipation and precision size of the heat dissipation substrate,is the future trend of LED industry development.Based on the injection molding process of 96%alumina ceramic substrate,a pressure injection molding process was adopted in this study to study the influence of pressure on the flatness and density of the billet,and the relevant process technologies such as formula system,injection molding pressure and sintering system were mainly studied to solve relevant technical problems.At the same time,the shrinkage of different parts of the ordinary injection and pressure injection were studied under the same sintering temperature.The results show that when the pressure is 0.030~0.032 MPa,the density difference of the billet is less than 0.16%,the flatness is better,the deformation of the fired product is smaller,the shrinkage change is smaller,and the density uniformity of each part is better.

关 键 词:氧化铝 基板 LED 注凝成型 压力 

分 类 号:TQ174[化学工程—陶瓷工业]

 

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