高复杂度PCBA装联工艺研究及应用  

Research and Application of High Complexity PCBA Assembly Process

作　　者：赵中 黄玉平 

机构地区：[1]广东威灵电机制造有限公司,佛山528300

出　　处：《日用电器》2024年第12期87-92,共6页ELECTRICAL APPLIANCES

摘　　要：本文通过研究工业级高复杂度PCBA器件特性,论述器件焊接工艺原理,识别出针对工业级器件的设计要点。涵盖BGA、0402Chip料、大热熔量插件物料等方面,围绕可制造性PCB设计、工艺制程参数两个角度进行分析验证。通过研究结果表明,工业级高端PCBA控制器通过工艺技术手段控制,可以实现良好的可制造性,为控制器生产厂商提供指导意义。Starting fromthe characteristics of industrial grade devices,the principle of device welding process is discussed,and the design points for industrial grade devices are analyzed.Fromthe perspectives of device characteristics such as BGA,0402Chip material,and high hot melt plugins,analysis and verification are conducted fromthe perspectives of manufacturability PCB design and process parameters.The research results indicate that industrial High complexity PCBA controllers can achieve good manufacturability through process technology control,providing guidance for controller manufacturers.

关 键 词：BGA 大热熔量插件 HIP 焊接工艺高复杂度PCBA装联工艺研究及应用 可制造性 

分 类 号：TN4[电子电信—微电子学与固体电子学]