关于QFN空洞机理及解决方案的应用研究  

Application Research of QFN Solder Void Mechanism and Solution

作　　者：赵中 黄玉平 

机构地区：[1]广东威灵电机制造有限公司,佛山528300

出　　处：《日用电器》2024年第12期163-168,共6页ELECTRICAL APPLIANCES

摘　　要：本文研究并验证了PCB设计在QFN封装空洞不良中的应用,同时匹配制程工艺因素的研究,根据QFN空洞的不良机理,提出并验证了QFN空洞的的改善方案。通过实验数据的对比,评估确认PCB设计和工艺制程的影响,为解决行业内QFN空洞的难题提供了设计端和制程端的解决方案。The application of PCB design in QFN package voids is studied and verified.At the same time,the research on matching process technology factors is carried out.According tothe QFN voiding defect mechanism,the improvement scheme of QFN voids is proposed and verified.Through the comparison of experimental data,the impact of PCB design and process was evaluated and confirmed,providing design and process solutions to solve the problemof QFN voids in the industry.

关 键 词：QFN 散热焊盘 空洞 制程 

分 类 号：TN4[电子电信—微电子学与固体电子学]