多通道压力扫描阀模块封装结构分析与性能研究  

Structure analysis and performance research of multi-channel pressure scanning valve module packaging

作　　者：姬留新 李庆忠 时广轶 黄楚霖 JI Liuxin;LI Qingzhong;SHI Guangyi;HUANG Chulin(School of Mechanical Engineering,Jiangnan University,Wuxi 214000,China;Wuxi Beiwei Sensing Technology Co Ltd,Wuxi 214000,China)

机构地区：[1]江南大学机械工程学院,江苏无锡214000 [2]无锡北微传感科技有限公司,江苏无锡214000

出　　处：《传感器与微系统》2025年第1期68-71,共4页Transducer and Microsystem Technologies

摘　　要：针对多通道压力扫描阀模块封装可靠性的问题,提出了一种多层印刷电路板(PCB)的封装结构,并对该结构进行了可靠性分析。利用仿真软件对单根金线及整个模块进行建模仿真分析。证明2个焊点的垂直距离对等效应力以及变形量均有影响;键合线易失效点集中在焊点颈部,通过降低2个焊点垂直距离可以降低等效应力及变形量,进而提高可靠性;在相同温度循环条件下,通过降低两焊点的垂直距离,使得等效应力降低2.6%、总变形量降低62.64%、竖直方向变形量降低39.9%,寿命达到2257个循环周期。通过搭建的测试平台,对压力扫描阀模块从线性度、重复性、回滞特性及测量误差等多角度进行分析。测试数据表明,采用多层PCB封装结构可以提高封装的可靠性。Aiming at the reliability problems of multi-channel pressure scanning valve module packaging,a multilayer printed circuit board(PCB)packaging structure is proposed and the reliability of the structure is analyzed.The single gold thread and the whole module are modeled and simulated by simulation software.It is proved that the vertical distance between two solder joints affects the equivalent stress and deformation.The failure points of bonding wires are concentrated in the neck of solder joints,and the equivalent stress and deformation can be reduced by reducing the vertical distance between two solder joints,thus improving the reliability.Under the same temperature cycling condition,by reducing the vertical distance between two solder joints,the equivalent stress,total deformation and vertical deformation are reduced by 2.6%,62.64%and 39.9%respectively,and the service life reaches 2257 cycles.Through the built test platform,the pressure scanning valve module is analyzed from the perspectives of linearity,repeatability,hysteresis characteristics and measurement error.The test data show that the reliability of the package can be improved by using multi-layer PCB packaging structure.

关 键 词：多层印刷电路板封装 引线键合 有限元仿真 多通道压力扫描阀 可靠性分析 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] TN303[自动化与计算机技术—控制科学与工程]