pH条件对铝合金化学机械抛光过程中纳米摩擦化学行为的影响  

Effect of pH on Nano-tribochemical Behavior in Chemical Mechanical Polishing of Aluminum Alloy

作　　者：朱玉广 王子睿 马服辉 梅璐 王正义 王永光[2] ZHU Yuguang;WANG Zirui;MA Fuhui;MEI Lu;WANG Zhengyi;WANG Yongguang(Engineering Training Center,Soochow University,Jiangsu Suzhou 215006,China;School of Mechanical and Electric Engineering,Soochow University,Jiangsu Suzhou 215006,China)

机构地区：[1]苏州大学工程训练中心,江苏苏州215006 [2]苏州大学机电工程学院,江苏苏州215006

出　　处：《表面技术》2025年第2期173-181,221,共10页Surface Technology

基　　金：国家自然科学基金面上项目(52375458)。

摘　　要：目的探讨pH条件对铝合金化学机械抛光微观过程中纳米摩擦化学行为的影响,表征抛光液在铝合金表面所形成的表面薄膜厚度及力学性能,并分析铝合金化学机械抛光过程中单磨粒接触状态与摩擦学特性。方法使用0.6%(体积分数)过氧化氢(H_(2)O_(2))和0.5%(质量分数)壳寡糖(COS)构成抛光液对铝合金表面进行处理,在铝合金表面反应生成的表面薄膜借助扫描电子显微镜进行细化表征。分析不同pH条件的抛光液对单磨粒/表面薄膜接触状态的影响规律,利用原子力显微镜测量了单磨粒/表面薄膜吸引力与黏附力数值。在纳米摩擦化学行为试验中,结合微观摩擦学理论模型阐明铝合金化学机械抛光过程中的摩擦化学去除机制。结果在抛光液化学反应后,铝合金表面将会形成100μm左右致密的氧化薄膜与40μm左右稀疏的氧化络合薄膜。当抛光液pH值升高至11~12时,探针针尖与铝合金表面薄膜的吸引力和黏附力将会分别降低至24.49、32.01nN。结论原子力显微镜试验和微观摩擦学理论模型的分析表明,铝合金的摩擦化学去除过程不是黏附力引起的磨粒法向接触载荷增大所产生的,而可能是抛光液的化学腐蚀作用所引起的。当化学机械抛光液pH值大于9时,铝合金表面将会形成氧化络合层,成为材料磨损加剧的主要影响因素。在界面摩擦力作用下,沉积在铝合金表面薄膜的铝原子会吸附在探针针尖OH^(*)基团上,从而产生黏合作用,探针针尖在纳米摩擦划动过程中将其除去。最后,铝合金表面薄膜呈现出更低的摩擦因数。In order to investigate the nano-tribochemical behavior in chemical mechanical polishing(CMP)of aluminum alloy,characterize the thickness and mechanical properties of the surface film formed by the CMP solution,and analyze the contact state and tribochemical characteristics of single abrasive particle in CMP.The surface of the aluminum alloy was treated with 0.6vol.%hydrogen peroxide(H_(2)O_(2))and 0.5wt.%chito-oligosaccharides(COS).The film generated on the surface was characterized by scanning electron microscope(SEM).The thickness of the dense oxidized film formed on the surface of aluminum alloy is about 90µm,which produced by the reaction of Al and O_(2) in the air.After chemical reaction,the average thickness of the oxidized film formed by 0.6vol.%H_(2)O_(2) is about 100μm,and its main components are Al_(2)O_(3)×3H_(2)O和Al_(2)O_(3).The average thickness of the oxidized and complexed film formed by 0.6vol.%H_(2)O_(2) and 0.5wt.%COS is about 100μm,and its main components are Al_(2)O_(3),Al(OH)3 and Al-COS.The influence of CMP solution at different pH values on the contacting state of single abrasive particle/surface film was analyzed.The attraction and adhesion values of single abrasive particle/surface film were measured by atomic force microscopy(AFM).In pure water,the attraction force(pull-off)is measured as 41.23 nN.This value decreases to 24.49 nN when the pH of the CMP solution increases to 11-12.Notably,the attractive interaction weakens when the tribochemical behavior occurs at high pH(>9).To detect the tribochemical mechanism of single abrasive particle at different pH values,the adhesive interactions between the single abrasive particle/surface film contact interfaces are compared.In pure water,the adhesion force(pull-off)is measured as 76.39 nN.This value decreases to 32.01 nN when the pH of the CMP solution increases to 11-12.The adhesion force decreases gradually as the CMP solution pH increases from 3 to 12.The tribochemical removal mechanism in CMP was elucidated in the nano-tribochemical

关 键 词：铝合金 化学机械抛光 纳米摩擦学 PH值 吸引力 黏附力 

分 类 号：TG356.28[金属学及工艺—金属压力加工]