微纳铜材料的制备及其在封装互连中的应用  

Preparation of Micro-Nano Copper Material and Its Applications in Package Interconnection

作　　者：彭琳峰 杨凯[1] 余胜涛 刘涛[1] 谢伟良 杨世洪 张昱[1] 崔成强 PENG Linfeng;YANG Kai;YU Shengtao;LIU Tao;XIE Weiliang;YANG Shihong;ZHANG Yu;CUI Chengqiang(State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment,Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东工业大学省部共建精密电子制造技术与装备国家重点实验室,广州510006

出　　处：《电子与封装》2025年第1期7-17,共11页Electronics & Packaging

基　　金：国家自然科学基金(62174039)。

摘　　要：半导体器件的快速发展对封装互连材料提出了更高的要求。微纳铜材料具有良好的导电、导热和机械性能。与常用的微纳银相比,微纳铜具有更强的抗电迁移能力和更低的成本,在封装互连领域被广泛应用。微纳铜材料的制备方法可分为化学法、物理法、生物法3类,其中化学液相还原法以低成本、高可控、工艺简单等优势占据重要地位。不同的封装互连工艺步骤需要不同形貌的微纳铜颗粒。微纳铜材料在封装互连中主要应用于芯片固晶、Cu-Cu键合、细节距互连等工艺,探讨了微纳铜材料在以上工艺中的应用,并对微纳铜材料在封装互连中的应用进行了展望。The rapid development of semiconductor devices has put forward higher requirements for package interconnection materials.Micro-nano copper material has good electrical,thermal and mechanical properties.Compared with the commonly used micro-nano silver,micro-nano copper has stronger resistance to electromigration and lower cost,and micro-nano copper is widely used in the field of package interconnection.The preparation methods of micro-nano copper materials can be divided into three categories:chemical method,physical method,and biological method,among which the chemical liquid-phase reduction method occupies an important position with the advantages of low cost,high controllability,and simple process.Different package interconnection process steps require micro-nano copper particles with different morphologies.Micro-nano copper materials are mainly used in processes such as chip solidification,Cu-Cu bonding,and fine pitch interconnection in package interconnection,the applications of micro-nano copper materials in the above processes are discussed,and the applications of micro-nano copper materials in package interconnection are prospected.

关 键 词：微纳铜 化学液相还原法 封装互连 

分 类 号：TN305.94[电子电信—物理电子学]